Processor-Heated Electric Radiator for Datacenter Heat Recovery

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Solution Overview

Problem

Datacenters face significant energy and financial costs in removing heat generated by computer servers, as existing systems require complex and energy-intensive air conditioning to manage high server concentrations.

Innovation Solution

An electric radiator utilizing processing circuits with connected computing processors as a heat source, coupled with a control interface to manage energy dissipation and provide computing resources, allowing for efficient heat transfer and utilization of heat generated by processors for heating purposes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air conditioning systems are used to remove heat from datacenters, then heat removal is achieved, but energy consumption and infrastructure costs increase significantly

Engineering Contradiction:

Improveheat removalVSAvoidenergy consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent converts the harmful heat waste from processors into a beneficial heating resource. The processing circuits generate heat as a byproduct of computing operations, and this heat is intentionally transferred to a heating body to provide space heating, thereby eliminating the need for separate air conditioning systems to remove this heat in datacenter environments.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent makes the processing circuit serve dual functions: computing operations and heat generation for heating purposes. By integrating the heating function directly into the processing circuit assembly, the system eliminates the need for separate heating and cooling infrastructure, reducing both energy consumption and infrastructure costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If processor computing capacity is increased, then processing performance improves, but heat generation increases requiring more complex cooling infrastructure

Engineering Contradiction:

Improveprocessing performanceVSAvoidcooling infrastructure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent converts the harmful effect of increased heat generation from high-performance processors into a beneficial heating resource. By designing the system to intentionally transfer this heat to a heating body, the patent eliminates the need for complex cooling infrastructure while maintaining high processing performance.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If dedicated heating systems are installed, then heating capability is provided, but device complexity and infrastructure costs increase

Engineering Contradiction:

Improveheating capabilityVSAvoidinfrastructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent makes the processing circuit serve dual functions: computing operations and heat generation for heating purposes. By integrating the heating function directly into the processing circuit assembly with a heating body, the system eliminates the need for separate dedicated heating infrastructure, reducing both complexity and costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The processing circuit serves itself by using its own operational heat as the heat source for heating the space. The system is self-sufficient, utilizing the waste heat already generated during normal computing operations without requiring external heating infrastructure.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient and cost-effective heat removal and utilization within the datacenter environment, reducing energy consumption and infrastructure costs while providing a dual function of heating and computing resource utilization.

Implementation Method 1

the latter being connected to a dissipating block to remove heat in the heating body

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

Heat transfer between each body is made by a combination of conduction, convection and radiation effects

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

Heat transfer between each body is made by a combination of conduction, convection and radiation effects

Methodology Applied

Scientific EffectRadiation: Thermal Radiation

Data Source

PatentUS9151515B2Electric radiator using calculating processors as a heat source

Publication Date: 2015.10.06 QARNOT COMPUTING

AI summary

An electric radiator is provided using calculating processors as a heat source and includes a heating body where the heat transfer between the heat source and the ambient air takes place; a number of processors distributed over a number of printed circuit boards forming the heat source of the radiator and a power resource carrying out calculations by external computer systems; a man-machine interface enabling the control of the calculating and calorific power supplied by the radiator; a power source stabilized for the different electrical components; and a network interface for connecting the radiator to the external networks.