Low Profile Processor Retention Device Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current processor retention mechanisms in smaller computer enclosures are inefficient due to reduced heat sink fin surface area and irregular heat sink geometries, leading to inadequate heat dissipation in compact systems.
Innovation Solution
A low profile computer processor retention device with a retention housing and load frame that directly contacts the processor substrate, allowing for a heat sink with increased fin height and surface area, and a non-irregular base shape to enhance heat transfer, coupled with a heat sink fastening member that compresses the heat sink to a thermal interface material for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional retention mechanism is used in smaller computer enclosures, then the processor can be retained in the socket, but the heat sink fin surface area is reduced leading to inadequate heat dissipation
Solution Approach 1:
The retention mechanism is divided into separate functional components: a retention housing that interfaces with the socket, a load frame that contacts the processor substrate, and a heat sink fastening member. This segmentation allows each component to be optimized independently, enabling the heat sink to achieve full fin surface area without interference from the retention mechanism.
Solution Approach 2:
The load frame acts as an intermediary between the retention housing and the heat sink assembly. It provides a dedicated contact point on the processor substrate while allowing the heat sink to be positioned optimally for heat dissipation, preventing the retention mechanism from encroaching on the heat sink's vertical space.
2Temperature
If the retention mechanism size is increased to improve heat sink fin surface area, then heat dissipation improves, but the enclosure size must be increased
Solution Approach 1:
The retention mechanism is redesigned to operate primarily in the horizontal plane rather than extending vertically. The retention housing interfaces with the socket in the horizontal plane, while the load frame makes contact with the processor substrate, freeing the vertical dimension for the heat sink fins to extend fully without obstruction.
3Temperature
If a pedestal-type heat sink base is used to contact the heat spreader, then the heat sink can be mounted, but heat flux through the base is reduced due to irregular geometry
Solution Approach 1:
The heat sink base is designed with uniform, regular geometry that provides consistent thermal pathways from the heat spreader contact point through the base to the fins. This local optimization of the base geometry ensures efficient heat flux without requiring irregular pedestal structures.
4Ease of operation
If direct contact on the heat spreader is used for retention, then the processor can be retained, but the heat sink fin height and surface area are reduced
Solution Approach 1:
The retention function is extracted from the heat spreader contact area and relocated to the processor substrate through the load frame. This separation allows the heat spreader to be fully utilized by the heat sink for thermal management without interference from retention mechanism contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation through increased surface area and improved heat flux, reducing material costs and increasing airflow in compact enclosures while maintaining processor performance.
Implementation Method 1
The heat sink may be in physical contact with a heat spreader of a processor or may be in contact with a thermal grease applied to a heat spreader
Implementation Method 2
Heat sinks are presently employed to dissipate heat generated by computer processors
Data Source
AI summary
A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.