Processor Cooling Assembly with Split Loading for Socket Contact
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Solution Overview
Problem
Existing methods for securing processors with a large number of pins require high forces that can cause uneven loading or damage to heat sinks, leading to reduced performance over time.
Innovation Solution
Splitting the force applied to the processor between a heat sink and a load plate, allowing the heat sink to focus on thermal coupling while the load plate handles mechanical contact, using materials suitable for their respective functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high force is applied to the heat sink to press the processor into the socket, then electrical contact is improved, but the heat sink suffers from delamination and warping
Solution Approach 1:
The force application function is segmented from the heat sink to a separate load plate. The load plate is responsible for applying downward force to ensure electrical contact between processor pins and socket, while the heat sink is relieved of this mechanical stress and focuses solely on thermal dissipation. This segmentation resolves the contradiction by allowing each component to perform its specialized function without compromising integrity.
Solution Approach 2:
A load plate is introduced as an intermediary component between the fastening mechanism and the processor. This load plate receives the fastening force and distributes it uniformly to press the processor into the socket, preventing direct application of concentrated force to the heat sink. The intermediary load plate protects the heat sink from damaging stresses while maintaining necessary electrical contact.
2Reliability
If the heat sink is fastened to apply high force, then processor contact is maintained, but thermal performance degrades due to warping
Solution Approach 1:
The functions of mechanical fastening and thermal dissipation are segmented into separate components: the load plate handles mechanical fastening and force application, while the heat sink handles thermal dissipation. This allows the heat sink to maintain its flat, optimal geometry for thermal contact without being subjected to warping forces, thereby preserving thermal performance while maintaining processor contact.
Solution Approach 2:
The load plate serves as an intermediary that absorbs and distributes the fastening force, preventing direct transmission of warping stresses to the heat sink. This intermediary structure ensures that the heat sink remains geometrically stable and maintains optimal thermal contact with the processor, while still achieving reliable processor contact through the load plate's force distribution.
3Reliability
If high force is applied to the heat sink, then pin contact is improved, but the heat sink base warps over time
Solution Approach 1:
The mechanical loading function is segmented from the heat sink base to a dedicated load plate. The load plate is designed to withstand and distribute the high forces required for reliable pin contact, while the heat sink base is relieved of these stresses and maintains its stable geometric composition. This segmentation prevents warping over time by eliminating the source of repetitive mechanical stress on the heat sink base.
Solution Approach 2:
The load plate acts as an intermediary structure that bears the mechanical loading between the fastening system and the processor. It distributes the applied force uniformly across the processor package, preventing concentrated stresses that would cause the heat sink base to warp over time. This intermediary protection maintains both reliable pin contact and stable heat sink base geometry throughout the product lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the risk of heat sink delamination and warping, maintaining effective thermal performance and electrical contact without excessive stress.
Implementation Method 1
The processor typically requires a heat sink to absorb and disperse heat generated in the processor
Implementation Method 2
When the compression spring is compressed by shortening a distance between the other end of a screw and a heat sink base, the compression spring provides elastic force for both the screw and the heat sink base
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.