Processor Workload Control for Multi-Location Temperature Management
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Solution Overview
Problem
Existing systems for controlling temperature in data processing devices and other temperature-sensitive components on structures, such as aircraft, often rely on resistive heaters and hermetically sealed covers, which are inefficient and may not effectively manage heat generation by processors, potentially leading to performance issues or damage due to excessive heat.
Innovation Solution
A method and apparatus that utilize temperature sensors and thermoelectric devices in conjunction with processors to control workload processing, allowing heat generated by processors to be managed and utilized to maintain desired temperatures at various locations on a structure, thereby reducing the need for resistive heaters and ensuring optimal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If resistive heaters and hermetically sealed covers are used to maintain desired temperature, then temperature stability is improved, but energy consumption increases and device complexity increases
Solution Approach 1:
The system uses the heat naturally generated by processors to maintain desired temperatures at various locations, eliminating the need for external resistive heaters. The processors serve their own thermal management needs while simultaneously providing heat to other components that require temperature maintenance.
Solution Approach 2:
The system converts the harmful effect of excess heat generated by processors into a beneficial resource by directing this heat to locations that require temperature maintenance. What was previously a problem (excessive heat) becomes a solution (heat source for temperature-controlled devices).
2Stability of the object's composition
If resistive heaters and hermetically sealed covers are used to maintain desired temperature, then temperature stability is improved, but device complexity increases
Solution Approach 1:
The system eliminates the need for separate temperature control devices by having processors directly manage their own thermal environment and simultaneously provide heat to other components. This self-service approach reduces device complexity while maintaining temperature stability.
Solution Approach 2:
The processors serve multiple functions: they perform data processing tasks, manage their own thermal conditions, and provide heat to other temperature-sensitive components. This multi-functionality eliminates the need for separate dedicated heating and temperature control devices.
3Productivity
If processors operate at higher speeds to process workload, then productivity is improved, but temperature increases leading to performance issues or damage
Solution Approach 1:
The system converts the excessive heat generated by high-speed processing into a useful resource by directing it to locations that require temperature maintenance. This allows processors to operate at high speeds without suffering from overheating, as the heat is productively utilized elsewhere in the system.
Solution Approach 2:
The system continuously monitors temperatures at various locations and dynamically adjusts workload distribution among processors based on real-time thermal conditions. This feedback mechanism ensures that processors can maintain high productivity while operating within safe temperature ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively maintains desired temperatures across multiple locations on a structure, optimizing performance by utilizing heat generated by processors and minimizing the need for additional heating methods, thus enhancing the reliability and efficiency of temperature control.
Implementation Method 1
A temperature sensor at each of a plurality of locations on a structure identifies a temperature at the location
Implementation Method 2
processors generate heat while in operation. Higher operating speeds generate more heat
Implementation Method 3
A temperature sensor at each of a plurality of locations on a structure, a processor at each of the plurality of locations, and a controller
Data Source
AI summary
An apparatus and method of controlling temperatures of a plurality of locations on a structure. A temperature at each of the plurality of locations is identified. A desired temperature for each of the plurality of locations is identified. Processing of a workload by a processor at each of the plurality of locations is controlled to control the temperature at each of the plurality of locations to match the corresponding desired temperature for each of the plurality of locations.