Production Management Device for Circuit Board Mounting Error Reduction
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Solution Overview
Problem
Current production management systems in production lines fail to effectively reduce production costs and minimize mounting errors in board products, leading to increased disposal of circuit boards and decreased production efficiency.
Innovation Solution
A production management device that stores inspection results from an inspection device as statistical information linked to mounting conditions, allowing for analysis of error trends and maintenance determination to reduce production costs and minimize board disposal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inspection results are stored and analyzed as statistical information linked to mounting conditions, then production costs are reduced and mounting errors are minimized, but device complexity increases
Solution Approach 1:
The patent introduces a production management device as an intermediary system that collects inspection results from appearance inspection devices and links them with mounting conditions. This mediator aggregates and analyzes statistical information, enabling error reduction without requiring complex modifications to existing mounting or inspection equipment.
Solution Approach 2:
The system implements feedback by continuously collecting inspection results, analyzing them as statistical information linked to mounting conditions, and using this analysis to identify and correct mounting errors. The feedback loop enables proactive error prevention while maintaining relatively simple device architecture.
2Manufacturing precision
If statistical analysis of inspection results is implemented to identify mounting error causes, then mounting precision improves, but loss of time increases due to data collection and analysis
Solution Approach 1:
The system performs preliminary actions by continuously collecting and pre-processing inspection results in the background, linking them with mounting conditions before errors become critical. This preliminary data preparation enables rapid error identification and correction without causing production delays.
Solution Approach 2:
The patent implements continuous data collection and analysis of inspection results linked to mounting conditions, transforming what could be discrete time-consuming operations into a continuous background process. This ensures mounting precision improvement without significant time loss, as the analysis occurs continuously rather than interrupting production.
3Manufacturing precision
If inspection and statistical analysis are performed to reduce mounting errors, then manufacturing precision improves, but productivity decreases due to additional inspection and analysis steps
Solution Approach 1:
The production management device performs multiple functions: collecting inspection results, linking them with mounting conditions, analyzing statistical information, and identifying errors. This multi-functional approach consolidates what could be separate productivity-reducing steps into a single integrated system, minimizing impact on production efficiency while improving mounting precision.
Solution Approach 2:
The system enables self-service by automatically analyzing inspection results and identifying mounting errors without requiring manual intervention. The automated statistical analysis and error identification process improves precision while maintaining productivity, as the system serves itself rather than requiring additional human resources.
Data Source
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AI summary
The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.