Profile Cutting Station With Integrated Laser Marking
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Solution Overview
Problem
Existing cutting stations for profiled elements, such as window and door frames, face inefficiencies due to large and separate marking assemblies that disrupt the machining process, leading to increased timelines, costs, and maintenance issues.
Innovation Solution
A cutting station integrated with a compact laser marking assembly that can engrave identification marks directly on the profiled elements during or after cutting, eliminating the need for consumables like paper and ink, and allowing continuous operation without interrupting the machining process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a traditional marking assembly is used, then identification marking can be performed, but the marking assembly requires large dimensions and must be placed at a distance from the cutting assembly, causing the machining process to be interrupted and increasing production timelines
Solution Approach 1:
The patent integrates the marking assembly directly onto the cutting assembly, merging two previously separate functions into one unified device. This allows marking and cutting operations to occur simultaneously at the same location, eliminating the need to move the profiled element between separate stations and thus preventing interruptions in the machining process.
Solution Approach 2:
The cutting assembly is designed to perform multiple functions: both cutting operations and marking operations. By making the cutting assembly universal, the system eliminates the need for separate dedicated marking equipment, thereby maintaining cutting precision while improving overall productivity through continuous operation.
2Measurement precision
If a traditional marking assembly is used, then identification marking can be performed, but the marking assembly requires paper and ink consumables that need frequent replacement and maintenance, increasing costs and operational disruptions
Solution Approach 1:
The patent replaces the mechanical marking system (which uses paper labels and ink) with a laser-based marking system. The laser assembly generates laser beams that directly mark the profiled element without requiring physical consumables like paper or ink, thereby eliminating the need for frequent replacement and reducing maintenance costs associated with consumable management.
Solution Approach 2:
Instead of using disposable consumables like paper labels and ink cartridges that require frequent replacement, the invention employs a durable laser assembly that can operate continuously without consumable replacement, significantly reducing long-term operational costs and maintenance requirements.
3Measurement precision
If a traditional marking assembly is used, then identification marking can be performed, but the marking assembly has numerous moving components that cause jams and functional drawbacks, increasing maintenance requirements
Solution Approach 1:
The patent replaces the mechanical marking system with an optical laser-based system. The laser assembly has fewer moving components compared to traditional mechanical marking assemblies, which reduces the likelihood of jams and functional failures, thereby improving operational reliability and reducing maintenance requirements.
4Ease of operation
If the marking assembly is placed at a distance from the cutting assembly, then the cutting tool movement is not hindered, but the profiled element must be further moved and positioned, increasing production timelines
Solution Approach 1:
The patent combines the marking assembly and cutting assembly into a single integrated unit, allowing both operations to occur at the same location. This eliminates the need to move the profiled element between separate marking and cutting stations, thereby reducing positioning time and maintaining ease of cutting tool movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated laser marking system reduces production timelines, lowers costs, and enhances production yields by enabling efficient and continuous marking of profiled elements, regardless of their length, while minimizing maintenance and operational disruptions.
Implementation Method 1
at least one laser marking assembly (22) associated with the basic structure (2) and adapted to emit at least one laser beam (R) towards the profiled element (P) in order to engrave at least one identification mark on the profiled element (P) itself
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The cutting station (1) for profiled elements, particularly for window and door frames, comprises one basic structure (2), one line of movement (3, 4) of one profiled element (P) associated with the basic structure (2) and adapted to move the profiled element (P) along a direction of movement (D) in order to displace it with respect to the basic structure (2), and one cutting assembly (5) associated with the basic structure (2), arranged along the direction of movement (D) and adapted to cut the profiled element (P) according to at least one angle of width comprised between 10° and 170° with respect to the longitudinal direction to obtain at least two portions of profiled element (PI, P2), wherein the station (1) comprises one laser marking assembly (22) associated with said basic structure (2) and adapted to emit one laser beam (R) towards the profiled element (P) in order to engrave one identification mark on the profiled element itself.