Composite Profile Micro-Hole Formation Using Embedded Wire Removal
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Solution Overview
Problem
Current methods for forming deep micro-holes in profiles with small hole sizes are limited by the need for sophisticated and expensive equipment, and struggle to achieve high accuracy and productivity, especially for hole sizes less than 3 millimeters.
Innovation Solution
A method using a continuous composite extrusion process where a continuous wire with the desired shape and size is embedded in a matrix, and then removed using physical or chemical differences between the wire and matrix, allowing for the formation of micro-holes without altering the matrix, enabling the creation of continuous, deep micro-holes with varying cross-sections and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional drilling or laser machining methods are used to form deep micro-holes with small hole sizes (less than 3mm), then the equipment can perform the machining operation, but the manufacturing precision and productivity are limited, and the equipment required is sophisticated and expensive
Solution Approach 1:
The wire is embedded into the profile matrix during the extrusion process before the micro-hole formation is needed. This preliminary placement of the wire as a placeholder eliminates the need for complex post-processing equipment, as the wire removal simply requires basic physical or chemical methods rather than sophisticated drilling or laser machinery.
Solution Approach 2:
The wire acts as an intermediary object that temporarily occupies the space where the micro-hole will eventually be formed. By using this intermediate element during extrusion and then removing it through simple means, the invention avoids the need for complex micro-hole drilling or laser machining equipment while achieving high precision micro-hole formation.
2Productivity
If conventional drilling methods are used for micro-hole formation, then the process can be performed with standard equipment, but the productivity remains low and tool breaking, hole deflection and severe hole blockage occur
Solution Approach 1:
The wire is pre-positioned during extrusion to define the exact micro-hole location and dimensions before any removal process. This eliminates the need for repeated drilling attempts that cause tool breaking and hole blockage, significantly improving both productivity and process reliability through a single-step wire removal operation.
Solution Approach 2:
The invention extracts the wire from the composite profile using simple physical or chemical methods after extrusion. This extraction approach replaces complex drilling operations entirely, eliminating tool breaking and hole deflection issues while maintaining high productivity through a straightforward removal process.
3Productivity
If laser machining with microlenses is used to form multiple micro-holes simultaneously, then productivity is substantially improved, but the equipment is sophisticated and expensive, and machining accuracy is limited by machine tools
Solution Approach 1:
Multiple wires can be embedded simultaneously during the extrusion process to define multiple micro-hole positions in advance. This preliminary placement allows for high-speed production without requiring complex laser machining equipment, as the wires are simply removed after extrusion to reveal the micro-holes.
Solution Approach 2:
The wire serves as an intermediary that enables simultaneous micro-hole formation during extrusion. By using wires as placeholders rather than attempting to machine multiple holes with lasers, the invention achieves high productivity through a single extrusion operation followed by simple wire removal, avoiding the need for sophisticated laser equipment.
4Length of stationary object
If deep micro-holes with small sizes are formed using traditional machining methods, then the holes can be created, but the depths and cross section sizes are limited by machine tool capabilities
Solution Approach 1:
The wire is embedded during extrusion with its length and position precisely controlled by the extrusion process parameters. This allows deep micro-holes to be formed without being limited by machine tool travel constraints, as the wire placement is determined during the extrusion operation itself rather than through subsequent drilling or machining.
Solution Approach 2:
The wire acts as an intermediary that enables the formation of deep micro-holes with small cross-sections by being placed during extrusion. The wire's dimensions can be precisely controlled through extrusion parameters, allowing deep holes with accurate small diameters that would be difficult to achieve with traditional machining methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process, eliminates the need for expensive equipment, and allows for the production of micro-holes with precise dimensions and continuous lengths, offering improved industrial applicability and productivity.
Implementation Method 1
removing the wire from the obtained composite profile without changing the matrix thereof using a method which is performed based on a difference in physical or chemical properties between the wire and the matrix of the composite profile
Data Source
AI summary
A method for making a profile with a micro-hole, in particular using a continuous composite extrusion process, comprises embedding, in a position in a matrix of the profile to be formed where a micro-hole is to be formed, a continuous wire having a shape and size consistent with that of the micro-hole; sawing a composite profile with the wire obtained by extrusion to a desired length; and removing the wire from the sawed composite profile using a predetermined physical or chemical method without changing the matrix of the composite profile so that the micro-hole of the predetermined size and shape is formed in the predetermined position in the profile. This method is simple, does not require any large, expensive, and sophisticated equipment, can produce continuous micro-holes of different specifications, and can be used in a wide variety of applications.