Profiled Interface Ridge Sealing for Pressure Sensor Modules
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Solution Overview
Problem
Existing pressure sensor devices face challenges in achieving a reliable seal with pressure ports, particularly when exposed to harsh fluids, and struggle to prevent potting compound from reaching the pressure sensing structure.
Innovation Solution
The pressure sensor module incorporates a body portion with a pressure port and an annular recess, featuring a pressure sensor apparatus with a profiled interface region that includes first and second surrounding ridge structures and a third ridge structure for secure adhesion, enhancing the seal and preventing potting compound ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circumferential wall is provided on the device package for sealing with the pressure port, then the sealing capability is improved for some applications, but the seal is insufficient for harsh fluid environments and potting compound prevention
Solution Approach 1:
The circumferential wall is segmented into multiple distinct ridge structures (first surrounding ridge, second surrounding ridge, third surrounding ridge) with different functions and positions. The first ridge provides primary sealing, the second ridge prevents potting compound ingress, and the third ridge ensures docking alignment, collectively solving the sealing insufficiency problem in harsh environments
Solution Approach 2:
An adhesive is introduced as an intermediary substance between the third surrounding ridge and the annular recess to secure the pressure sensor apparatus to the pressure port. This adhesive mediator enhances the sealing capability and prevents both harsh fluid leakage and potting compound ingress by creating an additional protective barrier
2Strength
If the device package is overmoulded to encapsulate the lead frame and pressure sensitive structure, then the structural integrity is improved, but the potting compound can still spill over into the pressure port
Solution Approach 1:
The first and second surrounding ridges are formed as integral parts of the overmoulded device package structure before the potting compound is applied. These ridges create preliminary barriers that prevent the potting compound from reaching the pressure sensitive structure, eliminating the harmful effect while maintaining structural integrity
Solution Approach 2:
The overmoulded device package incorporates localized ridge structures with specific geometries at critical positions. The first ridge extends further than the second ridge, creating different levels of protection in different areas, allowing the structure to resist potting compound ingress while maintaining overall structural strength
3Measurement precision
If the pressure sensor apparatus is directly docked with the pressure port, then the measurement accuracy is improved, but the sealing reliability deteriorates without additional securing mechanisms
Solution Approach 1:
The docking function and sealing function are merged into a single integrated solution. The third surrounding ridge provides both mechanical docking alignment and sealing contact with the pressure port, while the adhesive simultaneously secures the apparatus and enhances the seal, achieving both measurement accuracy and sealing reliability through combined mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides an improved seal against leakage of corrosive fluids and enhances resilience against potting compound, ensuring reliable performance of the pressure sensing structure while simplifying manufacturing and reducing costs.
Implementation Method 1
the front side of the profiled region comprises a third surrounding ridge structure adhered at least in part in the annular recess by an adhesive to secure the pressure sensor apparatus to the pressure port
Implementation Method 2
the front side is configured to abut sealingly, when in use, against an opposing surface to dock directly with the pressure port
Data Source
Figure 1~3
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Figure 6~7
AI summary
A pressure sensor apparatus (100) for incorporating into a pressure sensor module (200) comprises a pressure sensitive structure, a lead frame (104) operably coupled to the pressure sensitive structure, and a device package (102) comprising a profiled interface region (106). The profiled interface region (106) comprises a front side (108) and a back side (110). The front side (108) is configured to abut sealingly, when in use, against an opposing surface for direct docking with a pressure port (208) of the pressure sensor module. The back side (110) comprises a first surrounding ridge structure (112) and a second surrounding ridge structure (114). The profiled interface region (106) comprises an aperture (118) for providing access to the pressure port (208).