Semiconductor Stage Profiler Jig for Precision Inspection
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Solution Overview
Problem
Current semiconductor device processing inspection techniques rely on manual handling and expensive hardware, resulting in unsatisfactory results and potential damage to equipment, as they are not designed for quality control integration and lack precision.
Innovation Solution
A profiler jig system that automates the movement and control of a profiler over a semiconductor processing stage, enabling precise and repeatable inspection of the entire surface without disassembling the stage, using a sensor to detect imperfections and collect data on surface uniformity and other parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual handling and inspection techniques are used, then flexibility and adaptability are maintained, but measurement precision and reliability deteriorate
Solution Approach 1:
A jig is introduced as an intermediary device between the profiler and the semiconductor processing stage. The jig includes a mounting platform with positioning features that interface with the stage, and a profiler mounting structure that holds the sensor. This intermediary mechanism enables precise, repeatable measurements without requiring complex integration into the stage itself, resolving the contradiction between measurement precision and device complexity.
2Productivity
If automated profiler movement is implemented, then measurement precision and productivity improve, but device complexity increases
Solution Approach 1:
The profiler is designed to be self-contained on the jig, with the sensor mounted on a positioning structure that allows it to move independently over the processing stage. The jig itself serves as the support and positioning mechanism, eliminating the need for external automated positioning systems. This self-service approach improves productivity through automated scanning while minimizing the addition of complex external systems.
3Measurement precision
If disassembly of the processing stage is required for inspection, then access to surface imperfections is improved, but reliability and time consumption worsen
Solution Approach 1:
The profiler and its mounting structure are extracted as a separate, portable inspection system that can be positioned over the processing stage without requiring disassembly. The jig acts as a standalone inspection platform that provides all necessary positioning and measurement capabilities externally, eliminating the need to disassemble the stage while maintaining full inspection capability.
4Reliability
If manual inspection methods are used, then equipment cost is reduced, but measurement precision and reliability deteriorate
Solution Approach 1:
The inspection system is segmented into distinct functional modules: a mounting platform for positioning, a profiler mounting structure for sensor attachment, and the profiler itself for measurement. This segmentation allows each component to be optimized for its specific function while maintaining overall system simplicity. The modular design improves reliability through precise positioning and stable mounting without requiring a complex integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The profiler jig system provides increased precision and reduced overhead, allowing for efficient and accurate quality control of semiconductor processing stages, reducing the risk of damage and improving inspection capabilities compared to traditional manual methods.
Implementation Method 1
a profiler configured to detect variations along a surface of the semiconductor stage
Data Source
AI summary
In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.