In-Situ Programmable Cells for Semiconductor Manufacturability
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Solution Overview
Problem
Current integrated circuit manufacturing techniques face challenges such as wire shorting, improper via holes, and complexity in design for manufacturability (DFM) due to miniaturization, which existing DFM techniques at the cell level are insufficient to address effectively.
Innovation Solution
The method involves creating in-situ programmable cells by combining base cells with programmable overlay templates or parameterized phantom cells, allowing for post-placement modifications such as removing unused connections, moving internal wires, and adding metal for improved contact coverage, to enhance manufacturability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If standard cell methods are used to achieve greater circuit densities, then circuit density is improved, but manufacturing reliability deteriorates due to wire shorting and improper via holes in miniaturized circuits
Solution Approach 1:
The patent segments the cell design into two distinct parts: base cells (containing essential circuit elements) and overlay templates (containing manufacturing improvement features). This segmentation allows the overlay template to provide DFM features like extended metal coverage and adjusted wiring without modifying the fundamental base cell structure, thereby maintaining circuit density while improving manufacturing reliability.
Solution Approach 2:
The patent applies preliminary action by pre-configuring overlay templates with manufacturing improvement features before the actual placement and routing process. These templates include pre-designed elements such as extended metal coverage areas and adjusted wiring patterns that proactively address potential manufacturing issues like wire shorting and via hole problems before they occur during fabrication.
2Ease of manufacture
If DFM techniques are applied at the cell level, then manufacturability is improved, but device complexity increases due to the need to modify individual cell instances
Solution Approach 1:
The overlay template serves multiple functions simultaneously: it provides design for manufacturability features, maintains compatibility with standard cell placement and routing tools, and can be applied universally across different base cell types. This multi-functionality improves manufacturability without requiring complex cell-specific modifications, as the same overlay template structure can be reused across various cell instances.
Solution Approach 2:
The overlay template acts as an intermediary layer between the base cell and the manufacturing process. It mediates the conflict between maintaining simple base cell structures and incorporating DFM features by providing a separate, configurable layer that interfaces with standard tools while delivering manufacturing improvements. This intermediary approach avoids direct modification of base cells, reducing overall device complexity.
3Reliability
If existing DFM techniques are used, then some manufacturing issues are addressed, but they are insufficient to effectively address wire shorting, via hole problems, and complexity in miniaturized circuits
Solution Approach 1:
The patent introduces dynamics by making the overlay template configurable and adaptable to different manufacturing needs. The template can be dynamically adjusted to provide different DFM features depending on the specific base cell and routing requirements. This dynamic capability allows the system to effectively address a broader range of manufacturing issues including wire shorting, via hole problems, and spacing issues that static existing DFM techniques cannot handle.
Solution Approach 2:
The patent creates a composite cell structure by combining base cells with overlay templates. This composite approach integrates the functional elements of base cells with the manufacturing improvement elements of overlays, creating a unified structure that leverages the strengths of both components. The composite structure provides more comprehensive DFM coverage than existing techniques by combining multiple DFM features in a single integrated solution.
Data Source
AI summary
Methods, systems, and media to improve the manufacturability of cells and structures within cells of an integrated circuit are disclosed. Embodiments comprise a method of arranging programmable cells, routing the programmable cells, analyzing the cell arrangement and interconnect wiring for manufacturing improvement opportunities, and modifying the programmable cell structures to incorporate the manufacturing improvements. In some embodiments, wires are spread to prevent shorting. In other embodiments, the reliability of contacts and vias is improved by adding additional metallization to the areas surrounding the contacts and vias, or by adding redundant contacts and vias. In one embodiment, a series of manufacturing improvements are made to integrated circuit cells in an iterative fashion.