Programmable D2D Link Path Testing for Defect and Aging Detection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing semiconductor devices with die-to-die communication links face challenges in effectively testing transmission paths due to varying defect types and aging, as traditional fixed pattern generators are inadequate for differentiating defects and adapting to changing conditions.

Innovation Solution

Implementing programmable test circuits with programmable test patterns and conditions for die-to-die paths, allowing flexible testing through transmitter and receiver test circuits with programmable pattern circuits and control circuits, enabling adaptive testing based on defect profiles and aging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If fixed pattern generators are used for testing die-to-die paths, then the testing circuit is simple and fixed, but the ability to differentiate defect types and adapt to aging is insufficient

Engineering Contradiction:
Improveability to differentiate defect types and adapt to agingVSAvoidtesting circuit complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies the Dynamics principle by transforming the static, fixed pattern generator into a dynamic, programmable test circuit. The test circuit can now be reconfigured through programming to adapt to different defect types and aging conditions, while maintaining a relatively fixed hardware structure. This allows the same physical circuit to exhibit different testing behaviors based on programming, resolving the contradiction between adaptability and complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by allowing the test pattern parameters to be modified through programming rather than being fixed at manufacturing. The programmable test circuit can change testing parameters such as pattern selection, test conditions, and evaluation criteria based on the specific defect profile or aging stage being tested, thereby improving adaptability without requiring multiple different hardware circuits.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If programmable test circuits are implemented, then the adaptability to different defect types and aging conditions improves, but the device complexity increases

Engineering Contradiction:
Improvetesting efficacyVSAvoidtest circuit structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies the Universality principle by designing a single programmable test circuit that can perform multiple testing functions for different defect types and aging conditions. Instead of creating separate dedicated test circuits for each testing scenario, the programmable circuit can be configured through software/firmware to handle various test patterns and conditions, thereby improving reliability while controlling the increase in hardware complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces a programming interface and control logic as an intermediary between the user/test system and the physical test circuit. This intermediary layer allows complex testing behaviors to be achieved through programming rather than hardware complexity, enabling the test circuit to adapt to different scenarios without proportionally increasing its structural complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250383400A1Flexible pattern testing for d2d link paths
Publication Date: 2025.12.18 INTEL CORP
  • US20250383400A1 patent drawing
  • US20250383400A1 patent drawing
  • US20250383400A1 patent drawing

AI summary

In some embodiments, circuitry for implementing programmable die-to-die path test patterns is provided. A D2D link may include latches for transmitting data through a path between first and second dies and also may include transmit and receive test control circuits for programming desired patterns to be driven through the path in order to test it.