Programmable Interposer Routing for Multi-Die Package Compatibility
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Solution Overview
Problem
Designing a silicon interposer that can interface with different types of integrated circuit dies manufactured by multiple parties is challenging due to the need for fixed connections, making it difficult to achieve compatibility and efficiency in multichip packages.
Innovation Solution
A multichip package with a configurable interposer that includes programmable interconnect circuitry, such as vertical and horizontal routing paths, configurable multiplexers, configuration memory elements, and a configuration controller, allowing for customizable routing connections between dies and enabling the use of multiple dies in a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed connections are used in the silicon interposer, then manufacturing simplicity is maintained, but adaptability to different types of integrated circuit dies is reduced
Solution Approach 1:
The interposer employs programmable interconnect circuitry that can be dynamically configured through software to establish different routing connections between input-output pins and dies. This dynamic reconfigurability allows the same physical interposer to adapt to various die types and configurations without requiring physical changes to the interposer structure itself.
Solution Approach 2:
The interposer utilizes configuration memory elements that store control bits which can be programmed to change the routing parameters and connection topology. By modifying these configuration parameters, the interposer can be reconfigured to support different die arrangements, pin assignments, and routing paths, thereby achieving adaptability without hardware changes.
2Use of energy by moving object
If multiple dies are placed within a single integrated circuit package, then power consumption is reduced, but design complexity increases
Solution Approach 1:
The configurable interposer serves multiple functions: it provides mechanical support for multiple dies, establishes electrical connections between dies and the package substrate, enables routing between different die configurations, and can be reprogrammed to accommodate different applications. This multi-functionality consolidates what would otherwise require multiple specialized components into a single versatile device.
Solution Approach 2:
The interposer acts as an intermediary between the multiple dies and the package substrate, managing the complexity of inter-die and die-to-substrate connections. The programmable interconnect circuitry mediates the routing signals between different dies, allowing flexible configuration of the multi-die system while shielding the external interface from the internal complexity.
3Ease of manufacture
If standard interface formats are used, then ease of integration is improved, but routing flexibility is reduced
Solution Approach 1:
The interposer provides standard interface formats through its programmable interconnect, which can be dynamically configured to match various standard die footprints and pin assignments. The configuration memory elements store the mapping between standard interfaces and internal routing, allowing the same physical interface to adapt to different standards through software programming rather than hardware changes.
Data Source
AI summary
A multichip package that includes a programmable interposer is provided. Multiple integrated circuits may be mounted on the interposer. Active circuitry may also be embedded in the interposer device to facilitate protocol-based communications, debugging, and other desired circuit operations. The interposer device may include programmable interconnect routing circuitry that serves primarily to provide routing for the different circuits within the multichip package. A design tool may be used to design the interposer device. The design tool may include a standard die footprint library from which standard interface templates can be selected when designing an interposer device that has to communicate various on-interposer integrated circuits. The use of standard die footprints may simplify the design of interposers by enabling a family of devices to interface with a given interposer.