Programmable Interposer with Conductive Particles for I/O Adaptability
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Solution Overview
Problem
Interposers are often designed and fabricated individually to meet specific I/O requirements, leading to high costs and inefficiencies in applications where different configurations are needed, limiting their use in applications with varying I/O demands.
Innovation Solution
A programmable interposer with conductive particles is fabricated by situating interface electrodes on either side, moving conductive particles into aligned configurations using an energy field, and securing them into programmed paths through curing, allowing for customizable electrical connections without requiring highly differentiated design and fabrication processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If interposers are designed and fabricated individually to meet specific I/O requirements, then the interposer can adequately accommodate connection to the I/Os, but the cost and fabrication complexity increase significantly
Solution Approach 1:
The interposer substrate is designed with a universal structure that can accommodate multiple I/O configurations. Conductive particles are embedded in the substrate material, allowing the same interposer to be programmed for different I/O arrangements through selective connection rather than requiring different fabricated structures for each application.
Solution Approach 2:
The electrical connection parameters of the interposer are changed through the arrangement and configuration of conductive particles rather than through changes in the substrate fabrication. By repositioning or reconfiguring the conductive particles, the interposer can be adapted to different I/O requirements without requiring different substrate designs or fabrication processes.
2Adaptability or versatility
If interposers are designed and fabricated individually for each application, then the specific I/O requirements are met, but the production cost increases
Solution Approach 1:
A single interposer substrate design serves multiple applications by utilizing conductive particles that can be configured for different I/O requirements. This universal substrate can be used across various applications, eliminating the need for costly individual fabrication runs for each specific application.
Solution Approach 2:
Instead of fabricating unique interposers for each application, the invention uses a standardized substrate that can be replicated and programmed through conductive particle arrangement. The same substrate design can be copied and adapted to different applications through particle configuration rather than requiring unique fabrication for each case.
3Adaptability or versatility
If conductive particles are moved into aligned configurations using an energy field, then programmable paths can be created, but additional processing steps are required
Solution Approach 1:
The invention replaces traditional mechanical alignment methods with energy field-based particle manipulation. Instead of physically positioning conductive particles through mechanical means during fabrication, an energy field is used to move and align the particles into desired configurations, simplifying the programming process.
Solution Approach 2:
The conductive particles self-align into programmed paths when exposed to the energy field, eliminating the need for complex external alignment mechanisms or manual positioning. The particles automatically configure themselves into the desired electrical pathways through the energy field's influence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of interposers in applications with diverse I/O requirements by providing programmable paths that can be tailored to specific needs, reducing costs and fabrication complexities, and facilitating connections between electrical components.
Implementation Method 1
moving conductive particles into aligned configurations between the interface electrodes by applying an energy field to the programmable interposer
Implementation Method 2
securing the conductive particles into a programmed path by curing the programmable interposer to form a programmed interposer
Data Source
AI summary
An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.