Programmable Interposer Switching for Reconfigurable SiP Security
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Solution Overview
Problem
Existing interposers in the semiconductor industry lack the ability to be reconfigured after fabrication and assembly, limiting customization and flexibility in system-in-package (SiP) designs, especially in secure ICs fabricated in non-trusted environments.
Innovation Solution
A programmable interposer with a programmable metallization cell (PMC) switch that can be electrically configured between high and low resistance states, allowing for customization and reconfiguration post-fabrication and assembly, using a copper-silicon oxide material system for compatibility and low-temperature deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional interposers are used with fixed wiring, then manufacturing cost is minimized and fabrication is simplified, but reconfigurability and customization capability are lost
Solution Approach 1:
The patent applies the dynamics principle by replacing fixed interconnect structures with reconfigurable switches (e.g., anti-fuse, PMC, or transistor-based switches) that can dynamically change their electrical state between conducting and non-conducting. This allows the interposer to adapt its connectivity pattern after fabrication, enabling field reconfiguration and customization without requiring physical restructuring of the interposer itself.
Solution Approach 2:
The patent employs parameter changes by utilizing materials and mechanisms whose electrical properties can be altered post-fabrication. For example, anti-fuse elements transition from high to low resistance when programmed, and PMC switches change resistance states through electrochemical processes. These parameter changes enable reconfigurability while maintaining a relatively simple physical structure.
2Ease of manufacture
If secure ICs are fabricated in non-trusted environments, then manufacturing flexibility is improved, but security and trustworthiness of the system are compromised
Solution Approach 1:
The patent applies preliminary action by incorporating security-critical interconnect configuration into the interposer design that can be finalized and secured after the ICs are fabricated in non-trusted environments. The reconfigurable switches remain in a default or unprogrammed state during initial fabrication, allowing the physical manufacturing to occur in flexible, cost-effective facilities while the security-sensitive connectivity patterns are established later in trusted environments through programming or configuration processes.
Solution Approach 2:
The patent uses the interposer itself as an intermediary layer between the ICs and the external world, with reconfigurable switches acting as mediators that can control and obscure the true connectivity patterns. This intermediary structure allows secure configuration to be applied after fabrication, separating the manufacturing phase (which can occur in non-trusted environments) from the security-critical configuration phase (which occurs in trusted environments).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables custom system configurations, field reconfigurability, and functional obfuscation, reducing manufacturing costs and allowing for ultra-custom systems with enhanced security features, while maintaining compatibility with existing tools and processes.
Implementation Method 1
The PMC switch is electrically configurable between a high resistance state and a low resistance state
Implementation Method 2
using a copper-silicon oxide material system for compatibility and low-temperature deposition
Data Source
AI summary
Programmable interposers for connecting integrated circuits, methods for programming programmable interposers, and integrated circuit packaging are provided. The programmable interposers are electrically reconfigurable to allow custom system-in-package (SiP) operation and configuration, field configurability, and functional obfuscation for secure integrated circuits fabricated in non-trusted environments. The programmable interposer includes, in one implementation, an interposer substrate and a programmable metallization cell (PMC) switch. The PMC switch is formed on the interposer substrate and is coupled between a signal input and a signal output. The PMC switch is electrically configurable between a high resistance state and a low resistance state.


