Programmable Redistribution Die for Signal Routing Optimization
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Solution Overview
Problem
Microelectronic devices face challenges in optimizing signal distribution and routing due to fixed substrate interconnect configurations, which can lead to inefficient motherboard designs, increased costs, and reduced signal integrity, especially when dealing with varying semiconductor device designs and applications.
Innovation Solution
A programmable redistribution die with a programmable signal redistribution grid that uses conductive through silicon via interconnects to dynamically route signals from semiconductor dies to motherboard interconnects, allowing for customization of signal paths based on priority and optimizing signal output locations, thereby reducing the need for redesigning packages and motherboards for different applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If fixed substrate interconnect configurations are used, then manufacturing simplicity is maintained, but signal distribution efficiency and routing flexibility deteriorate
Solution Approach 1:
The patent implements a programmable signal redistribution grid that can dynamically reconfigure signal paths through programming, allowing the same physical substrate to adapt to different routing requirements for various semiconductor devices and applications, thus resolving the contradiction between manufacturing simplicity and routing flexibility
Solution Approach 2:
The patent changes the electrical connectivity parameters of the substrate by introducing a programmable redistribution layer that can alter signal distribution patterns after manufacturing, enabling the substrate to serve multiple configurations without requiring physical redesign or remanufacturing
2Device complexity
If fixed substrate interconnect configurations are used, then device complexity is reduced, but signal integrity and routing optimization deteriorate
Solution Approach 1:
The patent introduces a programmable redistribution layer as an intermediary between the fixed substrate interconnects and the semiconductor device, allowing optimization of signal paths for critical signals while maintaining the simplicity of the underlying substrate structure, thus improving signal integrity without significantly increasing overall device complexity
3Productivity
If custom package designs are created for different applications, then signal distribution efficiency is improved, but development costs and manufacturing complexity increase
Solution Approach 1:
The patent creates a universal substrate platform with a programmable redistribution grid that can be configured for different signal distribution patterns to accommodate various semiconductor devices and applications, eliminating the need for multiple custom package designs while maintaining optimized signal distribution for each application
Data Source
AI summary
A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.