Method for fabricating semiconductor device with programmable unit
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in integrating programmable units and redistribution structures effectively.
Innovation Solution
A semiconductor device design that includes a substrate, a first conductive layer, a programmable insulating layer, and a redistribution structure, where the bottom conductive layer, programmable insulating layer, and top conductive layer configure a programmable unit, with the redistribution structure being electrically coupled to the first conductive layer, and the use of materials like silicon oxide, silicon nitride, and carbon nanotubes with fluoropolymer for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor devices are scaled down to meet increasing computing demand, then computing ability is improved, but quality, yield, performance, and reliability deteriorate while complexity increases
Solution Approach 1:
The patent segments the semiconductor device into distinct functional regions including a first conductive layer, a second conductive layer, a programmable insulating layer, and a redistribution structure. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall device reliability despite scaling down dimensions.
Solution Approach 2:
The patent introduces a vertical stacking architecture with multiple conductive layers positioned at different vertical levels, connected through conductive vias. This three-dimensional arrangement increases functional density without further reducing lateral dimensions, thereby maintaining reliability while continuing to scale down the device footprint.
2Volume of moving object
If semiconductor devices are scaled down, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming the first conductive layer, forming the second conductive layer, depositing the programmable insulating layer, and creating the redistribution structure. Each stage can be independently optimized and controlled, reducing manufacturing complexity despite the reduced device size.
Solution Approach 2:
The conductive layers and insulating structures serve multiple functions: electrical conduction, mechanical support, and thermal management. This multi-functionality reduces the number of separate components needed, thereby simplifying the manufacturing process while maintaining small device dimensions.
3Adaptability or versatility
If programmable units and redistribution structures are integrated in scaled-down devices, then functionality is improved, but integration complexity increases
Solution Approach 1:
The patent merges the programmable unit and redistribution structure into a single integrated architecture where the bottom conductive layer, programmable insulating layer, and top conductive layer form a programmable unit that is directly coupled to the redistribution structure. This integration reduces the number of separate components and interconnections needed, thereby reducing integration complexity while maintaining full functionality.
Solution Approach 2:
The programmable unit is positioned vertically between the first and second conductive layers, utilizing the vertical dimension for integration. This three-dimensional arrangement allows the programmable functionality to be embedded within the device structure rather than added as a separate planar component, reducing integration complexity.
4Area of stationary object
If device dimensions are reduced, then area is reduced, but achieving improved quality and performance becomes more difficult
Solution Approach 1:
The patent transitions from a two-dimensional planar architecture to a three-dimensional stacked architecture with conductive layers at different vertical levels. This vertical expansion allows the device to maintain reduced footprint area while improving manufacturing precision through better control of each layer's thickness and positioning in the vertical dimension.
Solution Approach 2:
The device is segmented into discrete layers with well-defined interfaces, allowing each layer to be manufactured and characterized independently. This segmentation enables precise control over the properties of each layer (thickness, material composition, conductivity) thereby maintaining high manufacturing precision and quality despite reduced overall device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the integration of programmable units and redistribution structures, improving the reliability and efficiency of programming by creating a permanent conductive path and reducing thermal resistance, thus addressing the complexity and performance issues in scaled-down semiconductor devices.
Implementation Method 1
the thermal release layer is positioned on the redistribution conductive layer... configured to sustain a thermal resistance between about 0.04° C. cm2/Watt and about 0.25° C. cm2/Watt
Implementation Method 2
The thermal release layer includes an organic material interstitially mingled with carbon nanotubes... including a fluoropolymer material interstitially mingled with carbon nanotubes
Data Source
AI summary
The present application discloses a method for fabricating a semiconductor device. The method includes providing a substrate, forming a first conductive layer above the substrate, concurrently forming a bottom conductive layer and a redistribution structure above the first conductive layer, forming a programmable insulating layer on the bottom conductive layer, and forming a top conductive layer on the programmable insulating layer. The bottom conductive layer, the programmable insulating layer, and the top conductive layer together configure a programmable unit. The bottom conductive layer and the redistribution structure are electrically coupled to the first conductive layer.