Programmable Via Structure With Diffusion Barrier Isolation

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Solution Overview

Problem

Integrating programmable via technology with existing semiconductor architecture is challenging due to undesirable interactions with semiconductor device materials, affecting device performance.

Innovation Solution

A programmable via device is fabricated using a first dielectric layer, isolation layers, a heater, a capping layer, and conductive vias, with phase change material, to prevent contamination and facilitate integration by using diffusion barrier materials and CMOS process-compatible techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If programmable via technology is integrated with existing semiconductor architecture, then reconfigurable logic functionality is achieved, but material diffusion and contamination occur affecting device performance

Engineering Contradiction:

Improvereconfigurable logic functionalityVSAvoidmaterial diffusion and contamination

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A sacrificial layer is introduced as an intermediary component between the programmable via structure and the underlying semiconductor device layer. This sacrificial layer prevents direct interaction and harmful diffusion between the programmable via materials (phase change material, heater materials) and the semiconductor device materials during fabrication and operation. The sacrificial layer is temporarily present during processing and is subsequently removed to complete the device structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful interaction pathway is extracted by removing the direct contact between programmable via components and semiconductor device materials. The sacrificial layer is deposited over the device layer before forming the programmable via structure, effectively extracting the contamination pathway and isolating the two material systems from each other throughout the fabrication process.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of manufacture

If programmable via components are formed over device layer, then integration with semiconductor architecture is achieved, but device performance is degraded due to undesirable interactions

Engineering Contradiction:

Improveintegration with semiconductor architectureVSAvoiddevice performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The sacrificial layer serves as a protective intermediary that enables the formation of programmable via components over the device layer without causing performance degradation. It allows integration to proceed while blocking harmful interactions, thus maintaining device reliability during the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial layer is deposited in advance, before the programmable via structure is formed, to pre-establish protection against material diffusion and contamination. This preliminary protective measure ensures that subsequent processing steps do not compromise device performance.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables seamless integration of programmable via devices with semiconductor chips, preventing material diffusion and ensuring performance stability, thus addressing the integration challenges and enhancing logic functionality.

Implementation Method 1

a heater within the isolation layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the programmable via comprising at least one phase change material

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

at least one isolation layer over the first dielectric layer; a heater within the isolation layer

Methodology Applied

Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS20090033358A1Programmable via devices in back end of line level

Publication Date: 2009.02.05 GLOBALFOUNDRIES US INC

AI summary

Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; at least one isolation layer over the first dielectric layer; a heater within the isolation layer; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.