Projection Heat Dissipation Module for TEC Chip Crack Prevention
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Solution Overview
Problem
Conventional heat dissipation modules in projection devices suffer from the issue of the thermoelectric cooler chip (TEC chip) cracking due to uneven force distribution from spring rivets, leading to performance deterioration and reduced heat dissipation effectiveness.
Innovation Solution
A heat dissipation module design featuring an elastic component with slab parts that provide elastic force to a TEC chip, ensuring uniform support and preventing cracking, combined with a heat conduction and dissipation component to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If spring rivets are used to fix the TEC chip and heat dissipation component, then the components can be tightly fixed, but the uneven force distribution causes the TEC chip to crack
Solution Approach 1:
The patent introduces a force distribution component with multiple pressing points that are non-uniformly distributed. This local quality variation allows different regions of the TEC chip to experience adjusted pressures, preventing concentration of force at single points while maintaining overall fixing strength. The non-uniform pressing points strategically distribute mechanical stress to prevent cracking while ensuring adequate fixation.
2Loss of energy
If multiple spring rivets are used to fix the heat dissipation component, then the heat dissipation effect is improved, but the side of the TEC chip is compressed to crack
Solution Approach 1:
The force distribution component acts as an intermediary between the spring rivets and the TEC chip. It receives the compressive forces from multiple spring rivets and redistributes them through multiple pressing points across the TEC chip surface. This intermediary structure prevents direct concentration of force on the TEC chip side while maintaining the heat dissipation functionality provided by the multiple spring rivets.
3Power
If the force from spring rivets is increased to ensure tight fixation, then the heat dissipation performance is improved, but the TEC chip cracks due to excessive compression
Solution Approach 1:
The fixing force is segmented into multiple discrete pressing points rather than applied as a single concentrated force. The force distribution component divides the total fixing force into several localized pressures distributed across different points on the TEC chip. This segmentation allows the total power for heat dissipation to be maintained through multiple spring rivets while preventing excessive compression at any single point that would cause cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents TEC chip cracking while improving heat dissipation efficiency by evenly distributing elastic force, maintaining module performance and enhancing thermal management.
Implementation Method 1
each of the at least two slab parts of the elastic component provides the body with elastic force toward the heat conduction component
Implementation Method 2
The first surface of the TEC chip is thermally connected on the heat conduction component. The heat dissipation component is thermally connected on the second surface of the TEC chip
Data Source
AI summary
A heat dissipation module is provided and includes an elastic component, a heat conduction component, a TEC chip and a heat dissipation component. The elastic component includes a body where the heat conduction component is disposed and at least two slab parts extending outward from the body. The TEC chip has a first surface thermally connected on the heat conduction component and a second surface thermally connected on the heat dissipation component. The heat dissipation component is fixed to the slab parts. The orthographic projection of the body on the TEC chip overlaps the first surface, and the area of the orthographic projection of the body on the TEC chip is less than or equal to the area of the first surface, and thus the elastic force which is generated from the body is applied to the inner side of the TEC chip.