Projection Exposure Module With Integrated Local Heating

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Solution Overview

Problem

Existing temperature control methods for optical components in semiconductor lithography systems lack precise spatial control, leading to inefficiencies in correcting aberrations and maintaining desired optical effects.

Innovation Solution

Incorporating heating elements, such as optical resonators, directly into the components to achieve targeted and localized heating, allowing for precise spatial temperature control by converting electromagnetic radiation into heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If electromagnetic radiation is radiated onto an optical element with diffuse heating, then the optical element can be heated, but the spatial control of temperature is imprecise

Engineering Contradiction:
Improvespatial temperature control precisionVSAvoidheating system structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The heating system is segmented into multiple independently controllable heating zones within the optical element. Each zone can be heated separately through the integrated heating elements, allowing precise spatial temperature control without requiring a complex external heating system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heating elements are merged directly into the optical element structure, combining the heating function with the optical component. This integration achieves precise spatial temperature control while avoiding the complexity of separate external heating systems.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If heating elements are built into the component, then localized heating is achieved, but the manufacturing complexity increases

Engineering Contradiction:
Improveheat release position precisionVSAvoidcomponent manufacturing
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The heating elements are merged into the optical element during the manufacturing process, allowing precise positioning of heat release points. This integration achieves high manufacturing precision for temperature control while the heating elements are manufactured using standard fabrication techniques compatible with optical component production.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If multiple heating elements are used for spatially resolved temperature control, then temperature distribution can be precisely controlled, but the device complexity increases

Engineering Contradiction:
Improvespatial temperature distribution controlVSAvoidheating device structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The heating device is segmented into multiple independent heating elements that can be controlled separately. Each heating element corresponds to a specific spatial zone within the optical element, enabling precise spatial temperature distribution control through independent adjustment of each segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple heating elements are merged into a single integrated optical component, combining several heating functions into one unified device. This reduces the overall device complexity compared to having separate external heating systems for each zone.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective spatially resolved temperature control, enhancing the ability to correct aberrations and maintain consistent optical performance by defining desired heat release points within the components.

Implementation Method 1

heating elements, such as optical resonators, directly into the components to achieve targeted and localized heating, allowing for precise spatial temperature control by converting electromagnetic radiation into heat

Methodology Applied
Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Data Source

PatentUS20250334890A1Module for a projection exposure apparatus, method, and projection exposure apparatus
Publication Date: 2025.10.30 CARL ZEISS SMT GMBH
  • US20250334890A1 patent drawing
  • US20250334890A1 patent drawing
  • US20250334890A1 patent drawing

AI summary

A module for a projection exposure apparatus for semiconductor lithography comprises a heating device having at least one radiation source for emitting electromagnetic heating radiation for heating at least regions of a component of the module. The heating device comprises at least one heating element built into the component and configured to convert radiant energy into heat. A corresponding method and a projection exposure apparatus are disclosed.