Projection Heat Dissipation Module Partition Cooling
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Solution Overview
Problem
High-pressure mercury lamps and semiconductor devices with light-emitting diodes or laser diodes face challenges in effectively dissipating high heat-density, leading to temperature management issues.
Innovation Solution
A heat dissipation module with a housing divided into two accommodation spaces by a partition, featuring inlets and outlets that allow a cooling fluid to flow through heat dissipation sets, effectively transferring heat away from the heat source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If semiconductor devices with LEDs or laser diodes are used as light sources, then brightness and volume are improved, but heat-density increases leading to poor heat dissipation
Solution Approach 1:
The housing is divided into two separate accommodation spaces by a partition wall: a first accommodation space for the light source module and a second accommodation space for the heat dissipation set. This segmentation isolates the high-heat-density light source from the heat dissipation components, allowing independent optimization of both brightness generation and heat management.
Solution Approach 2:
A cooling fluid circulation system is implemented with cooling fluid inlet and outlet ports connected to the second accommodation space. The cooling fluid flows through the heat dissipation set, utilizing fluid convection to efficiently transfer heat away from the light source module, thereby resolving the heat-density problem while maintaining high brightness.
2Temperature
If a partition divides the housing into two accommodation spaces, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The partition wall serving as the divider between the two accommodation spaces simultaneously functions as a mounting structure for the heat dissipation set and as part of the cooling fluid circulation pathway. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration allows for efficient heat transfer and temperature reduction of high heat-density sources, improving the thermal management of projection apparatuses and semiconductor devices.
Implementation Method 1
heat accumulated at the heat dissipation set may be effectively transferred out
Implementation Method 2
The at least one inlet communicates with the first accommodation space, the at least one opening penetrates through the partition and communicates the first accommodation space with the second accommodation space
Data Source
AI summary
A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.