Heat Dissipation Module for Projection Devices
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Solution Overview
Problem
Current projection devices face challenges in effectively dissipating heat from wavelength conversion devices, which are prone to temperature increases due to dust and operating environment conditions, affecting optical efficiency and service life.
Innovation Solution
A heat dissipation module is designed with a first heat exchange element, a first cooling element, and a heat conductive structure, where the first heat exchange element is inside the closed housing, the first cooling element has a cold and hot side, and the second heat exchange element is outside, facilitating heat transfer from the wavelength conversion device through a sequence of heat exchange and conduction structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is placed in the closed chamber for internal flow field cooling, then heat dissipation is attempted, but air temperature in the closed chamber remains too high, affecting optical elements and fan operating environment
Solution Approach 1:
The patent extracts the heat dissipation function from the closed chamber environment by placing the heat exchange element outside the chamber. The wavelength conversion device is cooled internally by a cooling element, while the heat is transferred externally through the heat exchange element, separating the heat generation zone from the heat dissipation zone. This resolves the contradiction by removing heat from the confined space without compromising optical element reliability.
Solution Approach 2:
The patent introduces a heat exchange element as an intermediary between the wavelength conversion device and the external environment. This mediator transfers heat from the closed chamber to the outside through thermal conduction and external convection, enabling effective heat dissipation while maintaining the sealed protective environment for optical elements.
2Reliability
If the wavelength conversion device is enclosed by a closed chamber for dustproof effect, then dust protection is achieved, but temperature of the wavelength conversion device is raised, affecting service life
Solution Approach 1:
The patent segments the system into two functional zones: a closed chamber for dust protection containing the wavelength conversion device and optical elements, and an external heat dissipation system. This segmentation allows the chamber to maintain its protective function while the external heat exchange element handles thermal management, resolving the temperature accumulation problem.
Solution Approach 2:
The heat dissipation function is extracted from the closed chamber by placing the heat exchange element outside. This allows the chamber to remain sealed for dust protection while heat is actively removed through the external heat exchange element, preventing temperature rise that would otherwise affect service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation from the wavelength conversion device inside the closed housing to the outside, reducing the temperature and improving the service life and optical efficiency of the projection device.
Implementation Method 1
a first heat exchange element (111), a first cooling element (121), a second heat exchange element (112) and a first heat conductive structure (131)... heat emitted by the wavelength conversion device inside the closed housing can be transferred outside the closed housing
Implementation Method 2
The first cooling element has a cold side and a hot side opposite each other... the cold side of the first cooling element is located between the hot side of the first cooling element and the first heat exchange element
Implementation Method 3
The second heat exchange element is disposed outside the closed housing... heat emitted by the wavelength conversion device inside the closed housing can be transferred outside the closed housing
Data Source
AI summary
A heat dissipation module adapted to dissipate the heat of a wavelength conversion device located inside a closed housing is provided. The heat dissipation module includes a first heat exchange element, a first cooling element, a second heat exchange element and a first heat conductive structure. The first heat exchange element is disposed inside the closed housing. The first cooling element has a cold side and a hot side opposite each other. The first cooling element is disposed inside the closed housing, and the cold side is located between the hot side and the first heat exchange element. The second heat exchange element is disposed outside the closed housing. One end of the first heat conductive structure is connected to the hot side of the first cooling element, and the other end of the first heat conductive structure is connected to the second heat exchange element.