Projection Light Source Heat Sink Airflow Design

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Solution Overview

Problem

Conventional projection apparatuses face challenges in maintaining consistent light source temperatures and service lives due to varying heat dissipation efficiencies across different light source modules, requiring distinct heat-dissipating fin assemblies that increase development costs and complexity.

Innovation Solution

A light source heat-dissipating device with a first air duct and fan configuration that adjusts heat dissipation performances by stacking heat-dissipating fin assemblies and directing airflow to achieve consistent temperatures and efficiencies across modules, allowing for the same design and manufacturing mold for both assemblies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If different heat-dissipating fin assemblies with different structural designs or sizes are developed for light source modules at different positions, then the light source temperature consistency is improved, but the device complexity and development costs increase

Engineering Contradiction:
Improvelight source temperature consistencyVSAvoidheat-dissipating fin assembly variety
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by introducing compensatory elements (additional heat-dissipating fins or adjusted fin densities) in specific regions of the heat-dissipating fin assembly. These local modifications compensate for the weaker airflow at positions farther from the air inlet, ensuring uniform heat dissipation performance across all light source modules without requiring completely different assembly designs for each position.

Inventive Principle:
Principle #3Local quality

2Temperature

If the heat sink volume is increased or fan flow rate is increased for heat-dissipating fin assemblies with higher intake air temperature, then the light source temperature consistency is improved, but the device complexity and development costs increase

Engineering Contradiction:
Improvelight source temperature consistencyVSAvoidheat dissipation system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by systematically varying the heat dissipation parameters (fin density, fin surface area, fin geometry) of different heat-dissipating fin assemblies based on their positions. This allows each assembly to be optimized for its specific location's airflow conditions, achieving temperature consistency without requiring extreme increases in heat sink volume or fan flow rate across the entire system.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If different molds are used to produce heat-dissipating fin assemblies with different spatial or volumetric differences, then the light source temperature consistency is improved, but the manufacturing costs increase

Engineering Contradiction:
Improvelight source temperature consistencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent applies universality by designing a standardized heat-dissipating fin assembly structure that can serve multiple positions in the projection apparatus. By using a universal base design with adjustable or configurable elements (such as removable fin sections or adjustable fin angles), the same basic mold can produce assemblies suitable for different positions, reducing the need for multiple specialized molds while maintaining temperature consistency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures consistent heat dissipation and extended service life for light source modules by maintaining uniform temperatures and efficiencies, reducing development costs and simplifying manufacturing.

Implementation Method 1

the airflow generated by the fan brings the heat generated by the light source modules to enter the first heat-dissipating fin assembly and the second heat-dissipating fin assembly from the air intake side

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

the heat-dissipating fin assembly includes a first heat-dissipating fin assembly and a second heat-dissipating fin assembly... the first heat-dissipating fin assembly is positioned between the second heat-dissipating fin assembly and the air inlet

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11340519B2Light source heat-dissipating device and projection apparatus
Publication Date: 2022.05.24 CORETRONIC CORPORATION
  • US11340519B2 patent drawing
  • US11340519B2 patent drawing
  • US11340519B2 patent drawing

AI summary

A light source heat-dissipating device is disposed in a projection apparatus having a casing with an air inlet. The light source heat-dissipating device has a heat-dissipating fin assembly disposed in the casing and having an air intake side, and first and second heat-dissipating fin assemblies, a first air duct, and a fan adjacent to the first and second heat-dissipating fin assemblies. The second heat-dissipating fin assembly is stacked on the first one. The first heat-dissipating fin assembly is between the second one and the air inlet. The first air duct is adjacently-disposed at the air intake side, has a first entrance end connected with the air inlet and a first exit end opposite to the first entrance. The light source heat-dissipating device and projection apparatus improve temperature and life consistency between light source modules. The heat dissipation performances of the first and second heat-dissipating fin assemblies tend to be consistent.