Projector Case Thermal Management via Segmented Material Design

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Solution Overview

Problem

Conventional electronic apparatuses face challenges in effectively managing heat dissipation, particularly when high heat-generating components are integrated, as either high heat conductivity materials conduct heat excessively to the exterior or low conductivity materials fail to radiate heat efficiently, leading to reduced cooling capabilities and increased external surface temperatures.

Innovation Solution

The design incorporates a projector with a lower case made of magnesium alloy having higher heat conductivity than the upper case and bottom cover, utilizing a convex portion on the lower case to enhance heat radiation and a heat conductive sheet between the IC circuit board and the lower case to direct heat dissipation, while the bottom cover with lower heat conductivity covers the lower case to prevent external heat influx.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If high heat conductivity materials are used for the lower case, then heat radiation capability is improved, but external surface temperature increases

Engineering Contradiction:

Improveheat radiation capabilityVSAvoidexternal surface temperature

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The case is divided into multiple parts with different heat conductivity properties: the lower case uses high heat conductivity material (magnesium alloy) for heat radiation, while the bottom cover uses low heat conductivity material for thermal insulation. This segmentation allows each part to perform its specific thermal function optimally.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the case structure are assigned different thermal properties. The lower case is designed with high heat conductivity to radiate heat, while the bottom cover is designed with low heat conductivity to prevent external heat influx. This local differentiation of material properties resolves the contradiction between heat radiation and surface temperature control.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If low heat conductivity materials are used for the lower case, then external surface temperature is reduced, but heat radiation capability deteriorates

Engineering Contradiction:

Improveexternal surface temperatureVSAvoidheat radiation capability

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The case structure is segmented into the lower case and bottom cover, allowing the lower case to use high heat conductivity material for heat radiation while the bottom cover provides thermal insulation. This segmentation enables both heat radiation capability and external surface temperature control to coexist.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The lower case is locally designed with high heat conductivity material to enhance heat radiation, while the bottom cover is designed with low heat conductivity material to prevent external heat influx. This local quality differentiation allows the system to achieve both heat radiation and temperature control objectives.

Inventive Principle:

Principle #3Local quality

3Productivity

If the bottom cover is removed to improve heat radiation, then heat dissipation efficiency is improved, but external surface temperature increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidexternal surface temperature

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The bottom cover acts as a thermal intermediary layer between the lower case and the external environment. It provides thermal insulation to prevent external heat influx while allowing the lower case to maintain its heat radiation function. This intermediary structure resolves the contradiction between heat dissipation efficiency and external surface temperature control.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively cools high heat-generating components by radiating heat from the lower case and suppresses external surface temperature increases, maintaining cooling efficiency and reducing the risk of user injury from heat exposure.

Implementation Method 1

a lower case 24 made of magnesium alloy having higher heat conductivity than the upper case and bottom cover

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

utilizing a convex portion on the lower case to enhance heat radiation

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a heat conductive sheet between the IC circuit board and the lower case to direct heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 4

the bottom cover with lower heat conductivity covers the lower case to prevent external heat influx

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20240111206A1Electronic apparatus

Publication Date: 2024.04.04 CASIO COMPUTER CO LTD

AI summary

An electronic apparatus includes a first case, a second case provided in such a manner that an internal part is disposed between the first case and the second case, and a cover configured to cover an opposite side of the second case to a side facing the internal part, and a heat conductivity of the second case is higher than a heat conductivity of the cover.