Single Fan Cooling for Micro-Projector Heat Dissipation
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Solution Overview
Problem
Micro-projector devices face challenges in miniaturization due to the need for multiple heat dissipation fans to cool the laser light source, light valve, and fluorescent wheel, which increases size and complexity.
Innovation Solution
A projector device design that incorporates a single heat dissipation fan to cool multiple heat dissipation components located on the airflow path, eliminating the need for separate fans and enabling a smaller form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat dissipation fans are used to cool the laser light source, light valve, and fluorescent wheel, then heat dissipation effectiveness is improved, but device volume increases
Solution Approach 1:
The patent combines multiple heat dissipation fans into a single fan that serves multiple heat dissipation components (laser light source, light valve, and fluorescent wheel). The air outlet surface of the single fan is designed to face multiple heat dissipation components, allowing one fan to replace multiple fans and thereby reducing device volume while maintaining heat dissipation effectiveness.
Solution Approach 2:
The single heat dissipation fan is designed with multi-functionality to cool multiple different components (laser light source, light valve, and fluorescent wheel) simultaneously. The air outlet surface can face at least one of these components, enabling one fan to perform the heat dissipation function for multiple components that would traditionally require separate fans.
2Reliability
If multiple heat dissipation fans are used for different heat dissipation components, then cooling reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple heat dissipation fans into a single fan system, reducing device complexity by eliminating redundant components. The single fan is positioned and oriented to serve multiple heat dissipation components, maintaining cooling reliability through optimized airflow distribution to each component.
Solution Approach 2:
The single heat dissipation fan is designed with universal applicability to cool multiple different components (laser light source, light valve, fluorescent wheel). This multi-functional design reduces device complexity by using one component instead of multiple separate fans, while maintaining reliable cooling through proper airflow management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a more compact and efficient heat dissipation system, facilitating the miniaturization of micro-projector devices while maintaining effective cooling.
Implementation Method 1
The heat dissipation fan has an air outlet surface and is suitable for providing a heat dissipation airflow. The first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are all located on at least one flow path of the heat dissipation airflow.
Data Source
AI summary
A projector device including a device body, a first heat dissipation component, a second heat dissipation component, a third heat dissipation component, and a heat dissipation fan. The device body includes a light emitting element, a wavelength conversion element, a light valve, and a projection lens. The first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are connected to the light emitting element, the light valve, and the wavelength conversion element. The heat dissipation fan has an air outlet surface and is adapted to provide a heat dissipation airflow. The air outlet surface faces at least one of the first heat dissipation component, the second heat dissipation component, and the third heat dissipation component. The first heat dissipation component, the second heat dissipation component and the third heat dissipation component are all located on at least one flow path of the heat dissipation airflow.