Projector Heat Sink Design for Misaligned Light Source Mounting
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Solution Overview
Problem
High-brightness light sources in projectors, such as semiconductor light emitting devices, generate significant heat, and existing cooling systems face challenges due to production errors in device holders, leading to inefficiencies in heat dissipation.
Innovation Solution
The electronic device incorporates a configuration with first and second device holders, heat conductive plates, heat dissipating fins, and heat pipes to ensure effective heat transfer and dissipation, even when device holders' rear surfaces are not perfectly aligned, by using heat conductive plates and heat pipes to connect device holders with heat dissipating fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If highly bright light emitting devices are used as light sources, then illumination intensity is improved, but temperature increases due to excessive heat generation
Solution Approach 1:
The patent converts the harmful heat generated by high-brightness light emitting devices into a manageable thermal management challenge by implementing a sophisticated heat dissipation system. The heat conductive plates and heat pipes transform the waste heat into a controlled thermal flow that can be efficiently dissipated through heat dissipating fins, thereby maintaining both high brightness and acceptable operating temperatures.
Solution Approach 2:
The patent introduces heat conductive plates as intermediary components between the light emitting devices and heat dissipating fins. These plates serve as thermal mediators that efficiently transfer heat from multiple light sources to the heat dissipation system, enabling effective thermal management while preserving the high brightness output of the light sources.
2Volume of stationary object
If device holders are disposed close to one another to reduce size, then volume of stationary object is reduced, but manufacturing precision deteriorates causing misalignment of rear surfaces
Solution Approach 1:
The heat conductive plates are designed with self-aligning features that enable them to automatically compensate for misalignment between device holders. The plates' flexible mounting mechanism allows them to adapt to positional variations, ensuring reliable thermal contact without requiring high manufacturing precision, thus enabling compact design while tolerating production variations.
Solution Approach 2:
The patent employs heat conductive plates with adjustable thermal contact parameters that can adapt to misaligned device holders. By changing the contact pressure and thermal conductivity parameters of the plates, the system maintains effective heat transfer even when device holders are not perfectly aligned, allowing for reduced size without compromising manufacturing precision.
3Loss of energy
If heat conductive plates are used to dissipate heat from device holders, then heat dissipation efficiency is improved, but device complexity increases due to additional components and alignment requirements
Solution Approach 1:
The patent merges the heat conductive plates with the device holder structure, integrating thermal management functionality into the existing support framework. This combination reduces the number of separate components while maintaining effective heat dissipation, as the heat conductive plates serve dual purposes of structural support and thermal conduction.
Solution Approach 2:
The heat conductive plates are designed as multi-functional components that simultaneously provide structural support, thermal conduction, and alignment compensation. This universal design reduces overall device complexity by eliminating the need for separate alignment mechanisms and simplifying the heat dissipation system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the cooling efficiency of high-brightness light sources by ensuring consistent heat dissipation, maintaining performance despite potential misalignment of device holders, and allows for a compact design of the projector.
Implementation Method 1
two first heat pipes which connect the first device holder with the first heat dissipating fin so that heat can be conducted therebetween, and a second heat pipe which connects the second device holder and the second heat dissipating fin so that heat can be conducted therebetween
Implementation Method 2
a first heat conductive plate and a second heat conductive plate which are connected to the first device holder and the second device holder, respectively
Implementation Method 3
a first heat dissipating fin which is disposed by the side of the second device holder which is disposed to lie adjacent to the first device holder, a second heat dissipating fin which is disposed adjacent to the first heat dissipating fin
Data Source
AI summary
An electronic device has a first device holder and a second device holder each having a heat generating device attached thereto, a first heat conductive plate and a second heat conductive plate which are connected to the first and second device holders, respectively, a first heat dissipating fin disposed by the side of the second device holder which is disposed adjacent to the first device holder, a second heat dissipating fin disposed adjacent to the first heat dissipating fin in the same direction as the first heat dissipating fin, two first heat pipes which connect the first device holder with the first heat dissipating fin so that heat can be conducted therebetween, and a second heat pipe which connects the second device holder and the second heat dissipating fin so that heat can be conducted therebetween and which is disposed between the two first heat pipes.