Projector Light Source Heat Dissipation Fin Alignment
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Solution Overview
Problem
Projector designs using laser light sources face challenges with heat density leading to increased temperature and decreased light emission efficiency, and existing cooling solutions often result in larger projector sizes due to increased heat sink size.
Innovation Solution
The projector incorporates a light source apparatus with a substrate, frame, and lid configuration that allows for efficient heat dissipation using a heat sink with elongated heat dissipation fins and a fan for air flow, optimizing cooling performance while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor light emitters are incorporated in a single package to reduce size, then the size of the light source apparatus is reduced, but heat density increases resulting in increased temperature and decreased light emission efficiency
Solution Approach 1:
The light source apparatus is divided into multiple independent light emitter units, each with its own heat dissipation structure. This segmentation allows heat to be dissipated from multiple distributed points rather than concentrating heat in a single location, effectively managing heat density while maintaining compact packaging.
Solution Approach 2:
Heat dissipation is extended into the vertical dimension by incorporating heat dissipation fins that extend upward from the light emitter mounting surface. This three-dimensional heat dissipation structure increases the heat dissipation area without increasing the horizontal footprint, allowing effective cooling within a compact package.
2Temperature
If air-cooling-type cooler is used to cool light emitters, then cooling performance is improved, but size of the projector increases due to larger heat sink
Solution Approach 1:
Heat dissipation fins are strategically positioned only in regions where heat generation is highest, specifically at the light emitter mounting areas. This localized heat dissipation approach concentrates cooling capacity where it is most needed while avoiding unnecessary heat sink material in other regions, optimizing the balance between cooling performance and overall size.
Solution Approach 2:
The heat dissipation structure utilizes vertical space by extending fins upward from the mounting surface, creating a three-dimensional heat dissipation pathway. This vertical dimension allows significant heat dissipation area to be achieved without increasing the horizontal footprint, thereby maintaining a compact projector design while providing effective air cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools the light source, maintaining high light emission efficiency while keeping the projector compact by aligning heat dissipation fins with the air flow and using a fan to enhance cooling performance.
Implementation Method 1
a heat sink including a heat dissipation fin that dissipates heat in the light source apparatus
Implementation Method 2
a fan that produces an air flow that cools the heat dissipation fin
Implementation Method 3
a fan that produces an air flow that cools the heat dissipation fin
Implementation Method 4
a lid including a translucent member that transmits light outputted from the plurality of light emitters
Data Source
AI summary
A projector includes a light source apparatus, light modulator, projection optical apparatus, exterior enclosure, and heat sink. The light source apparatus includes a substrate having first and second substrate surfaces, light emitters at the side facing the first substrate surface, a frame at the side facing the first substrate surface surrounding the light emitters, and a lid facing the first substrate surface. The light emitters are in an accommodation space formed by the substrate, frame, and lid. The exterior enclosure has a first surface, a second surface that intersects the first surface, and a third surface that intersects the first and second surfaces, and the area of the first surface is greater than the areas of the second and third surfaces. The first or second substrate surface faces the first surface, and the lengthwise direction of the heat dissipation fin extends along the first surface of the exterior enclosure.