Projector PCI Heat Dissipation to Reduce Wind Resistance
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Solution Overview
Problem
Existing heat dissipation structures in projectors, particularly those using heat tubes and straight-rib exchangers, suffer from high heat resistance, wind resistance, and turbulent flow, which hinder efficient heat transfer and reduce the performance of high-power LED light sources and optical machines.
Innovation Solution
The implementation of a projector with a thermal superconducting material using Phase Change Inhibited (PCI) plates and fins, combined with fans for air circulation, to enhance heat dissipation capacity and efficiency, addressing issues of heat resistance and wind resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat tube heat exchanger is used for heat exchange, then heat transfer function is provided, but wind resistance increases and heat exchange efficiency decreases
Solution Approach 1:
The patent changes the fundamental parameter of heat transfer material from conventional heat tube to PCI (phase change inhibited) material, which has superior thermal conductivity and phase change characteristics. This parameter change enables more efficient heat transfer while reducing wind resistance and turbulent flow effects.
Solution Approach 2:
The patent employs composite material structure combining PCI material with specific fin configurations. The composite design integrates the phase change properties of PCI material with the heat dissipation functionality of fins, creating a system that simultaneously achieves high heat exchange efficiency and low wind resistance.
2Temperature
If heat tube is used for heat dissipation, then heat transfer is achieved, but heat resistance increases and temperature uniformity decreases
Solution Approach 1:
The patent changes the thermal conductivity parameter by using PCI material instead of conventional heat tube material. PCI material exhibits higher thermal conductivity and controlled phase change behavior, which reduces heat resistance and improves temperature uniformity across the heat dissipation surface.
Solution Approach 2:
The patent segments the heat dissipation function into multiple fins attached to the PCI plate. This segmentation allows heat to be distributed across multiple surfaces, improving in-plane temperature uniformity while the PCI material maintains low heat resistance through its superior thermal conductivity.
3Power
If conventional heat dissipation structure is used, then basic heat transfer function is provided, but heat dissipation capacity is insufficient for high-power LED light sources
Solution Approach 1:
The patent fundamentally changes the thermal parameters of the heat dissipation system by introducing PCI material, which has superior thermal conductivity and phase change characteristics. This enables the system to handle higher power densities while maintaining efficient heat dissipation capacity suitable for high-power LED light sources.
Solution Approach 2:
The patent transitions from one-dimensional heat tube heat transfer to two-dimensional heat dissipation across the PCI plate surface with multiple fins. This dimensional expansion increases the heat dissipation capacity and efficiency by providing larger surface area and multiple heat transfer pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The projector achieves improved heat dissipation capacity and efficiency, reducing heat resistance and wind resistance, and maintaining high in-plane temperature uniformity, thereby enhancing the performance of high-power LED light sources and optical machines.
Implementation Method 1
a phase change inhibited (abbreviated as PCI) heat transfer technology is an emerging technology that realizes high-efficient heat transfer by controlling a state of a micro-structure 'phase' of a heat transfer working medium
Implementation Method 2
the heat transfer passage 12' is filled with a phase change inhibited (PCI) heat transfer working medium; the overall heat transfer speed and bearable heat flow density of the PCI are much better than that of the heat tube
Implementation Method 3
an inner circulation fan 14, a projection light source 21 and an LCD light valve 26, which are located inside the projector housing; heat generated by the LCD light valve is sent by the blowing of the inner circulation fan to the heat absorption fin set
Data Source
AI summary
A projector with a thermal superconducting material for heat dissipation is disclosed. The projector includes a projector housing, and an optical machine shell, a thermal superconducting material heat dissipation apparatus, an outer fan, an inner circulation fan, a projection light source and an LCD light valve. The thermal superconducting material heat dissipation apparatus includes a light source radiator and an optical machine heat exchanger. The outer fan performs air draft for the light source radiator. An inner circulation air duct is arranged inside the optical machine shell. The inner circulation fan, the LCD light valve and a heat absorption fin set are arranged in the inner circulation air duct. A heat dissipation ventilation duct is defined between an inner wall of the projector housing and an outer wall of the optical machine shell.