Projector Thermal Module With Protrusion Heat Sink
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Solution Overview
Problem
Current heat dissipation technologies for projectors using semiconductor light sources, such as LEDs or lasers, face challenges in effectively managing high heat density due to the small size and high luminous power of these sources, leading to inadequate cooling and potential projector malfunction.
Innovation Solution
A thermal module with a heat sink featuring protrusions and through holes that facilitate liquid flow, enhancing heat exchange through conduction and convection, and incorporating a fan for forced convection, which improves heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fan cooling is used for the light source, then the device complexity is reduced, but the heat dissipation performance is insufficient due to excessive heat concentration
Solution Approach 1:
The patent applies water-cooling technology with a liquid cooling channel system to replace or supplement fan cooling. The cooling liquid flows through channels in contact with the light source, providing high-efficiency heat removal that addresses the insufficient heat dissipation performance of fan cooling while managing the concentration of heat from high-power semiconductor light sources.
Solution Approach 2:
The patent optimizes heat dissipation by changing thermal parameters through the cooling system design, including liquid flow rate, channel geometry, and thermal contact area. These parameter adjustments enable effective heat removal from the concentrated heat source without requiring excessive system complexity.
2Temperature
If water-cooling technology is applied, then the heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The patent integrates the cooling liquid channel directly with the light source housing or mounting structure, merging the cooling function with the existing structural components. This integration approach improves heat dissipation performance while minimizing the increase in device complexity by eliminating separate cooling components.
Solution Approach 2:
The cooling system is designed to serve multiple functions: it cools the light source, provides structural support, and may serve as part of the light source housing. This multi-functionality reduces the overall device complexity while maintaining effective heat dissipation performance.
3Illumination intensity
If the light source size is reduced for high brightness, then the illumination intensity is improved, but the heat concentration increases
Solution Approach 1:
The patent applies localized cooling measures directly at the light source position, with cooling channels positioned in maximum thermal contact with the small high-power light source. This local quality approach ensures that the concentrated heat from the compact bright light source is removed efficiently at the exact location where heat is generated.
Solution Approach 2:
The cooling liquid acts as an intermediary substance that absorbs heat from the concentrated light source and transports it away. This intermediary mechanism enables the light source to maintain small size for high brightness while the liquid mediator handles the heat concentration problem by providing a thermal transfer path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal module effectively dissipates heat, maintaining projector operation and extending its lifespan by reducing thermal resistance and pressure drop, while also improving water-cooling performance.
Implementation Method 1
enhancing heat exchange through conduction and convection
Implementation Method 2
enhancing heat exchange through conduction and convection
Implementation Method 3
incorporating a fan for forced convection, which improves heat dissipation efficiency
Data Source
AI summary
A thermal module and a projector using the same are provided. The thermal module comprises a heat sink and a base. The heat sink comprises a bottom, a plurality of fins, a cover, and a plurality of side walls. The fins are disposed on the bottom, and each of the fins comprises a reference plane and a plurality of protrusions, wherein adjacent two of the protrusions are convex toward opposite directions with respect to the reference plane, and rows of through holes are formed by adjacent two protrusions along a flowing direction. The cover is disposed on the fins. The side walls are disposed between the bottom and the cover and surrounding the fins, wherein a liquid is capable of flowing through the heat sink by entering the inlet and exiting by the outlet of the side walls or the cover. The bottom of the heat sink is disposed on the base.