Projector Thermal Module Selection via Airflow and Space Dimensions
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Solution Overview
Problem
The existing methods for selecting thermal modules in projectors are inefficient, leading to prolonged testing times and delayed manufacturing due to the lack of appropriate determination criteria for optimal heat dissipation in limited spaces.
Innovation Solution
A projector design that determines the type of thermal module based on the dimension of the space and airflow parameters, using a reference value calculation to choose between three-dimensional vapor chamber or tower thermal modules for effective heat dissipation, thereby shortening manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sequential testing of various thermal modules is performed to find the most suitable one, then heat dissipation effectiveness can be optimized, but manufacturing time is significantly prolonged
Solution Approach 1:
The patent changes the selection parameter from empirical testing to calculated reference values based on space dimensions and airflow parameters. By using the formula Y=[2.9×(V+1)×(P-2.3)²+2.4×(V-3.308)²+15.82] where V is airflow velocity and P is fin pitch, the system determines the appropriate thermal module type (three-dimensional vapor chamber or tower) without sequential testing, thus reducing manufacturing time while maintaining heat dissipation effectiveness
Solution Approach 2:
The patent replaces the mechanical testing process with a computational calculation system. Instead of physically installing and testing multiple thermal module types, the system uses airflow parameters (velocity V) and structural parameters (fin pitch P) to calculate a reference value Y that directly determines the suitable thermal module type, substituting empirical mechanical testing with theoretical computation
2Volume of moving object
If limited heat dissipation space is utilized with compact thermal modules, then projector miniaturization is achieved, but heat dissipation efficiency may be compromised
Solution Approach 1:
The patent applies local quality by matching specific thermal module types to specific space conditions. The calculation reference value Y determines whether to use three-dimensional vapor chamber thermal modules or tower thermal modules based on the local space dimension L and airflow conditions. This localized optimization ensures that each thermal module configuration is optimally suited to its specific space constraints while maintaining heat dissipation efficiency
Solution Approach 2:
The patent introduces dynamics by making the thermal module selection adaptable to varying airflow parameters (velocity V) and structural parameters (fin pitch P). The reference value Y is dynamically calculated based on these parameters, allowing the system to optimize heat dissipation efficiency for different operating conditions and space configurations rather than using a fixed thermal module design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for quick determination of the most suitable thermal module, enhancing heat dissipation efficiency and reducing manufacturing time by selecting the appropriate thermal module type based on calculated reference values and space dimensions.
Implementation Method 1
a three-dimensional vapor chamber thermal module or a tower thermal module
Implementation Method 2
an average velocity of the airflow before entering the plurality of fins is V
Implementation Method 3
a tower thermal module may include a base having at least one groove, at least one heat pipe
Implementation Method 4
an average velocity of the airflow before entering the plurality of fins is V
Data Source
AI summary
Embodiments of the disclosure provide a projector including a housing, a light source module, a light engine module, a projection lens module, and a thermal module. An airflow is formed in the housing. The thermal module is disposed in the housing and includes a base and a plurality of fins. The housing has a space for accommodating the thermal module, and a dimension of the space is L. An average velocity of the airflow before entering the plurality of fins is V, and a pitch between adjacent fins of the plurality of fins is P, and a reference value Y=[2.9*(V+1)*(P−2.3)∧2+2.4*(V−3.308)∧2+15.82], and when L is greater than or equal to Y, the thermal module is a three-dimensional vapor chamber thermal module or a tower thermal module.