Protected Chip Layout for Backside Attack Photon Detection
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Solution Overview
Problem
Electronic chips, particularly those containing sensitive information like bank card chips, are vulnerable to attacks from the rear side, where attackers use Ion FIB ion beams, lasers, or electromagnetic/photonic emission analysis to access or disrupt circuit elements, lacking effective protection against such invasive methods.
Innovation Solution
The implementation of an electronic chip with a metallic screen covering the rear side and a photon detector on the front, utilizing a Spad diode and a ring oscillator to detect and respond to photon emissions, thereby preventing attacks by distinguishing normal photon arrival frequencies from those indicative of an attack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip uses a metallic screen covering the rear side to block attacks, then the protection against backside attacks is improved, but the detection capability of photon emissions from the circuit is worsened
Solution Approach 1:
The patent introduces a photon detector as an intermediary component that can detect photon emissions from the circuit through the metallic screen. The detector acts as a mediator between the circuit and the external environment, allowing detection of electromagnetic emissions while maintaining the protective function of the metallic screen.
Solution Approach 2:
The patent employs a thin metallic screen that is sufficiently thin to allow photon transmissions from the circuit to pass through to the detector, while still providing mechanical protection and blocking most backside attacks. The screen functions as a flexible barrier that balances protection and detection needs.
2Strength
If the chip uses a thick substrate to strengthen structural protection, then the strength against physical attacks is improved, but the photon transmission capability to the detector is worsened
Solution Approach 1:
The patent optimizes the thickness parameter of the substrate to a specific range that allows sufficient photon transmission while maintaining adequate structural strength. By carefully selecting and adjusting the substrate thickness parameter, the system achieves a balance between mechanical protection and optical detection capabilities.
3Device complexity
If the chip uses no additional protection layers to maintain simplicity, then the device complexity is reduced, but the reliability against electromagnetic attacks is worsened
Solution Approach 1:
The patent makes the metallic screen serve multiple functions simultaneously: it provides mechanical protection against physical attacks, acts as an electromagnetic shield against electromagnetic interference and attacks, and functions as a transmission medium for photon detection. This multi-functionality reduces the need for separate protection layers while maintaining comprehensive security.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents rear-side attacks by maintaining the integrity of the metallic screen and accurately detecting attempts to access or disrupt the chip's circuits, ensuring the security of the chip's information.
Implementation Method 1
a photon detector (108), preferably comprising a single-photon avalanche diode (SPAD), arranged to detect photons emitted by the circuit (104)
Implementation Method 2
a first screen (106), preferably metallic... arranged to reflect photons incident thereon
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The present description relates to an electronic chip comprising first and second superimposed screens (109, 106) and a first photon detector (108) located between the first and second screens.