Protected Chip Stack Using Identical Functional and Connecting Materials
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Solution Overview
Problem
Current protected chip stacks can be vulnerable to chemical attacks that allow unauthorized access and information retrieval, as the separation of chips in such stacks does not necessarily destroy the functional layers, and implementing complex cryptographic protocols is costly and inefficient.
Innovation Solution
A protected chip stack is created with a mechanical connection between chips using connecting elements made of the same material as the functional layers, ensuring that any chemical attack to separate the chips would also destroy the functional layers necessary for chip functionality, thereby preventing unauthorized access without the need for complex cryptography.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex cryptographic protocols (encryption algorithms) are implemented to protect against chemical attacks, then security against unauthorized access is improved, but device complexity and cost increase
Solution Approach 1:
The patent converts the harmful effect of chemical attacks into a beneficial security mechanism by making the functional layer and connecting element identical materials. Any chemical attack strong enough to separate the chips will necessarily destroy the functional layer, thus converting the attack vector into a self-destruct mechanism that prevents information theft.
Solution Approach 2:
The patent merges the structural connection function and the functional operation into a single integrated system where the connecting element and functional layer are made of the same material. This merging ensures that any attempt to compromise the connection automatically compromises the functionality, eliminating the need for separate cryptographic protection layers.
2Reliability
If current protective measures (shielding, sensors, encapsulations) are applied to protect chips, then security against physical analysis is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the protective connection structure with the functional operational layer into a single integrated design. By making the connecting element and functional layer identical materials that are directly contacted, the patent eliminates the need for separate protective enclosures, shielding layers, or additional sensor systems, thereby simplifying manufacturing while maintaining security.
Solution Approach 2:
The functional layer itself serves the dual purpose of both operational functionality and security protection. The same material that performs the chip's functional operations also provides the security mechanism against chemical attacks, eliminating the need for separate protective components and simplifying the manufacturing process.
3Strength
If face-to-face connection with soldering or adhesive bonding is used to connect chips, then mechanical strength of connection is improved, but vulnerability to chemical attacks increases
Solution Approach 1:
The patent converts the weakness of chemical vulnerability into a strength by using identical materials for the functional layer and connecting element. Any chemical attack that could dissolve traditional soldering or adhesive connections would necessarily destroy the functional layer made of the same material, thus converting chemical vulnerability into a security feature.
Solution Approach 2:
The patent applies homogeneity by making the connecting element and functional layer identical materials. This homogeneous construction ensures uniform chemical resistance properties throughout, where any chemical capable of attacking the connection is equally capable of destroying the functional layer, thereby eliminating the security gap between connection strength and chemical resistance.
Data Source
AI summary
A protected chip stack having a first chip and a second chip on the first chip. A functional layer in at least the first chip or the second chip. On the first chip and on the second chip there is in each case a connecting element, the connecting element on the first chip forming with the connecting element on the second chip a mechanical connection between the two chips. The connecting element and the functional layer are made of the same material. At least in the case of the first chip or in the case of the second chip, the connecting element is in direct contact with the functional layer.