Protected Electrode Structure With Release Layer for Thin Coatings

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Solution Overview

Problem

Existing methods for forming protective layers in electrochemical cells face challenges in achieving a substantially continuous and thin protective layer due to the limitations in surface smoothness of electroactive material layers, which affects cell performance and internal resistance.

Innovation Solution

A method involving a release layer with a lower surface roughness than the electroactive material layer is used, allowing for the deposition of a thinner, continuous protective layer, and subsequent electroactive material layer, with the release layer potentially remaining part of the electrode structure or being delaminated.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective layer is formed directly on the electroactive material layer, then the protective layer provides necessary protection, but the protective layer thickness must be increased to compensate for surface roughness, resulting in higher cell internal resistance

Engineering Contradiction:
Improveprotective layer continuityVSAvoidprotective layer thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

A release layer is introduced as an intermediary between the electroactive material layer and the protective layer. This release layer has a smoother surface than the electroactive material layer, enabling the protective layer to be deposited more uniformly at reduced thickness while maintaining continuity and protection functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The traditional single-layer structure (electroactive material + protective layer) is segmented into a multi-layer structure by inserting the release layer. This segmentation allows the protective layer to be decoupled from the rough electroactive material surface, enabling thinner and more continuous protective layer formation.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the protective layer thickness is reduced to lower cell internal resistance, then rate capability improves, but the protective layer becomes discontinuous due to underlying surface roughness

Engineering Contradiction:
Improverate capabilityVSAvoidprotective layer continuity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The release layer serves as a mediator that decouples the protective layer from the rough electroactive material surface. This allows the protective layer to be deposited at reduced thickness for improved rate capability while the release layer's smoother surface ensures continuous coverage without defects.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If a release layer is introduced between the electroactive material layer and protective layer, then thinner and more continuous protective layers can be formed, but the device structure becomes more complex

Engineering Contradiction:
Improveprotective layer uniformityVSAvoidelectrode structure layers
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The release layer is designed to serve multiple functions: it provides a smooth surface for protective layer deposition, acts as a release layer during manufacturing, and can remain in the final structure as an additional protective barrier. This multi-functionality justifies the added layer by providing multiple benefits rather than just increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of thinner protective layers with improved continuity and reduced cell internal resistance, enhancing the rate capability of electrochemical cells while maintaining structural integrity.

Implementation Method 1

depositing a first protective layer on the surface of the first release layer

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS11894545B2Protected electrode structures
Publication Date: 2024.02.06 SION POWER CORP
  • US11894545B2 patent drawing
  • US11894545B2 patent drawing
  • US11894545B2 patent drawing

AI summary

An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer.