Protecting Layer for Fan-Out Panel Level Package Redistribution
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Solution Overview
Problem
The conventional fan-out panel level package (FOPLP) technology faces issues with the dielectric layer being over-etched during cleaning and etching processes, leading to damage in the redistribution layer and affecting the package device's characteristics.
Innovation Solution
A protecting layer is formed to cover the release layer and conductive pads, which protects the redistribution layer from damage during cleaning and etching, ensuring effective cleaning and bonding of solder balls to the conductive pads, thereby enhancing the product yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the dielectric layer is exposed during cleaning and etching processes, then the cleaning effectiveness is improved, but the redistribution layer structure is damaged
Solution Approach 1:
A protecting layer is introduced as an intermediary element between the dielectric layer and the cleaning/etching environment. This protecting layer serves as a mediator that allows effective cleaning to occur while preventing direct damage to the redistribution layer structure, thus resolving the contradiction between cleaning effectiveness and structural integrity
Solution Approach 2:
The protecting layer is formed in advance before the cleaning and etching processes. This preliminary action prepares the structure by creating a protective barrier that will prevent damage during subsequent processing steps, allowing the redistribution layer to maintain its integrity while still enabling effective cleaning
2Ease of manufacture
If the dielectric layer is over-etched, then the cleaning process is more effective, but the conductive pad and redistribution layer are damaged
Solution Approach 1:
The protecting layer acts as an intermediary that enables thorough cleaning without allowing the etching process to penetrate and damage the conductive pad and redistribution layer. It provides a controlled interface that permits cleaning effectiveness while maintaining device reliability
Solution Approach 2:
The protecting layer provides beforehand cushioning or protection to the underlying structures. It absorbs or prevents the harmful effects of over-etching, allowing the cleaning process to be more effective without compromising the integrity of the conductive pad and redistribution layer
Data Source
AI summary
The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.