Protective Case Chamfered Plate Recess Wear

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Solution Overview

Problem

Conventional protective cases with folding structures often suffer from appearance defects such as indentations and scratches on the surface due to the wear and tear during folding, which compromises their aesthetic appeal.

Innovation Solution

A protective case design featuring multiple plates with recesses, a pivot module, and a dual-layer covering system where the outer and inner layers are bonded to the plates, and the plates' edges have chamfers and rounded corners to prevent damage and enhance folding functionality, allowing the device to be supported in various upright positions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a folding structure is equipped on the protective case to support the electronic device in different orientations, then the adaptability and ease of operation are improved, but the outer covering layer is worn out during folding resulting in appearance defects

Engineering Contradiction:
Improvesupport different orientationsVSAvoidappearance defects
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by adding chamfers specifically at the side edges adjacent to recesses where folding occurs, while the rest of the plate surfaces maintain their original smooth finish. This localized modification protects the covering layer only at the critical folding zones without altering the overall appearance or structure of the protective case.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The chamfers are pre-formed on the plate surfaces before the covering layer is applied or before use. This preliminary action ensures that the covering layer is positioned correctly relative to the recesses and that the protective geometry is already in place to prevent wear during subsequent folding operations.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If the outer covering layer is bonded directly to the plate surface without chamfers, then the manufacturing process is simpler, but the covering layer is worn out during folding operations

Engineering Contradiction:
Improvebonding processVSAvoidwear resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The chamfers are implemented only at specific locations (side edges adjacent to recesses) rather than throughout the entire plate surface. This localized approach adds minimal manufacturing complexity while providing targeted protection where folding wear occurs, balancing ease of manufacture with wear resistance.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If chamfers are added to the side edges of the plates, then the wear on the outer covering layer is reduced, but the manufacturing complexity increases

Engineering Contradiction:
Improvewear reductionVSAvoidplate geometry
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The chamfers are applied only at the specific side edges adjacent to recesses where folding wear occurs, rather than modifying the entire plate geometry. This localized modification minimizes the increase in manufacturing complexity while providing effective wear protection at the critical locations.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3714729B1Protective case
Publication Date: 2021.09.22 ASUSTEK COMPUTER INC
  • EP3714729B1 patent drawingFigure 1
  • EP3714729B1 patent drawingFigure 2
  • EP3714729B1 patent drawingFigure 3A

AI summary

A protective case adapted for an electronic device is provided. The protective case includes a plurality of plates, at least one pivot module, an outer covering layer, and an inner covering layer. Each plate includes an inner surface and an outer surface, and at least one recess is defined between the plates. The pivot module is disposed in the recess and is connected to the plates. The outer covering layer is bonded to the outer surface of each plate and covers the recess. The inner covering layer is bonded to the inner surface of each plate and covers the recess. A side edge of the outer surface adjacent to the recess includes a chamfer.