Protective Case Magnetic Interlayer Embedding Flatness
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Solution Overview
Problem
Existing methods for manufacturing electronic device protective cases with embedded magnetic parts result in increased thickness and aesthetic issues due to deformation and uneven adhesive distribution, leading to impressions on the surface.
Innovation Solution
A method involving a magnetic interlayer with a through installation hole, where the magnetic part is fixedly embedded, and a hot-melt base material with reinforcing fiber yarn is used, allowing the hot-melt base material to fill the gap between the magnetic part and the installation hole, ensuring flatness through hot pressing and atmospheric pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If magnetic parts are directly placed on the interlayer base material and fixed with hot-melt adhesive, then the magnetic part can be embedded in the protective case, but the height difference between the magnetic part and the interlayer base material causes deformation and impressions on the surface
Solution Approach 1:
The patent applies preliminary action by pre-forming a through-hole in the interlayer base material before embedding the magnetic part. This allows the magnetic part to be inserted at the correct depth from the beginning, preventing height difference issues and surface deformation that occur when magnetic parts are added after the base material is formed.
Solution Approach 2:
The patent introduces a glue covering layer as an intermediary substance that fills the gap between the magnetic part and the interlayer base material. This mediator eliminates the height difference and prevents surface impressions while maintaining the structural integrity of the protective case.
2Length of moving object
If the thickness of the protective case is reduced to make it thinner, then the competitive advantage is improved, but the deformation control becomes more difficult
Solution Approach 1:
By pre-forming the through-hole at the correct depth in the interlayer base material, the patent ensures that the magnetic part is embedded at the precise required thickness from the start. This preliminary action allows for thinner case designs while maintaining deformation control, as the magnetic part does not add extra height that would require additional compensation layers.
Solution Approach 2:
The patent changes the parameter of hole depth to match the magnetic part thickness exactly. By controlling the through-hole depth parameter to be equal to the magnetic part thickness, the patent achieves precise thickness control of the final protective case while preventing surface deformation.
3Manufacturing precision
If adhesive is used to cover the magnetic part, then the surface can be flattened, but the amount of adhesive is difficult to control causing embossing or debossing
Solution Approach 1:
The glue covering layer acts as an intermediary that automatically fills the gap between the magnetic part and the interlayer base material. The amount of adhesive required is precisely controlled by the dimensions of the through-hole and magnetic part, eliminating the need for excessive adhesive application and preventing embossing or debossing defects.
Solution Approach 2:
The adhesive system is designed to be self-regulating, where the glue automatically fills the specific gap created by the through-hole configuration. The hole depth and magnetic part dimensions self-determine the exact amount of adhesive needed, eliminating the need for manual adhesive quantity control and preventing surface defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner, more durable electronic device protective case with a smooth surface, eliminating impressions and enhancing appearance and texture.
Implementation Method 1
the hot-melt base material filled between the magnetic part and the installation hole is formed by melting of the interlayer base material after heating
Implementation Method 2
the surface of the magnetic interlayer is kept flat by hot pressing
Data Source
AI summary
A protective case for electronic device includes an inner shell, an outer shell, and a magnetic interlayer that fits and in contact with the inner shell and the outer shell, wherein: the magnetic interlayer includes an interlayer base material and a magnetic part, the magnetic interlayer is provided with a through installation hole, and the magnetic part is fixedly embedded in the installation hole, the thickness of the magnetic part matches with the depth of the installation hole, the interlayer base material includes a hot-melt base material and reinforcing fiber yarn contained in the hot-melt base material, and the hot-melt base material is filled between the magnetic part and the inner side wall of the installation hole.