Protective Circuit Module Grounding via Conductive Vias
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Solution Overview
Problem
Lithium-based secondary batteries are vulnerable to disruptions due to their unstable chemical composition, particularly from external factors like electromagnetic waves and static electricity, which can lead to over-charge, over-discharge, and over-current issues, necessitating a protective circuit module to prevent performance degradation.
Innovation Solution
A protective circuit module is designed with a printed circuit board featuring an integrated circuit chip, electronic components, and a pattern part for grounding, including capacitors and electrode pads, which are connected through conductive vias to minimize the impact of externally induced electromagnetic waves and static electricity by routing current away from the integrated circuit chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective circuit module is added to protect lithium-based secondary batteries from over-charge, over-discharge, and over-current, then battery safety and reliability are improved, but device complexity increases
Solution Approach 1:
The patent combines the protective circuit components (integrated circuit chip, electronic components, capacitors) onto a single printed circuit board, merging multiple protective functions into one integrated module. This consolidation maintains comprehensive protection against over-charge, over-discharge, and over-current while reducing overall device complexity compared to separate protective components.
Solution Approach 2:
The integrated circuit chip performs multiple protective functions simultaneously - monitoring charge/discharge states, detecting over-current conditions, and controlling battery protection. This multi-functionality allows one component to provide comprehensive safety protection, improving reliability without proportionally increasing device complexity.
2Object-affected harmful factors
If capacitors are connected to ground pattern on the same printed circuit board surface, then electromagnetic wave shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes the third dimension by connecting capacitors to the ground pattern through conductive vias that extend vertically through the printed circuit board. Instead of placing capacitors and ground patterns on the same two-dimensional surface, the solution moves the connection to another dimension (through the board thickness), effectively shielding electromagnetic waves while maintaining simple planar manufacturing processes.
Solution Approach 2:
The conductive vias act as intermediaries between the capacitors mounted on one surface and the ground pattern on the opposite surface. These vias provide the necessary electrical connection while enabling the electromagnetic shielding function, resolving the conflict between shielding effectiveness and manufacturing simplicity.
3Reliability
If the integrated circuit chip is directly connected to ground, then grounding effectiveness is improved, but susceptibility to electromagnetic waves and static electricity increases
Solution Approach 1:
The patent introduces capacitors as intermediary components between the integrated circuit chip and the ground connection. These capacitors filter out high-frequency noise, electromagnetic waves, and static electricity while allowing DC ground potential to pass through, thereby maintaining grounding effectiveness while protecting against harmful electrical transients.
Solution Approach 2:
The capacitors are positioned in advance between the integrated circuit chip and ground to cushion against incoming electromagnetic waves and static electricity. This preemptive placement absorbs and filters harmful electrical disturbances before they can directly affect the integrated circuit chip, preventing damage while maintaining proper grounding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the influence of external electromagnetic waves and static electricity, enhancing the robustness of the battery pack against disruptions and maintaining stable power supply, with significant current reduction (up to 95% for one capacitor configuration) to the integrated circuit chip.
Implementation Method 1
a first capacitor (C1) connected between a power supply terminal (VDD) of the integrated circuit chip and the ground pattern
Implementation Method 2
The one or more electronic components may be connected to the pattern part through a conductive via
Data Source
AI summary
A protective circuit module and a battery pack having the same are disclosed. In one embodiment, the protective circuit module includes a printed circuit board, an electronic device mounted on a first surface of the printed circuit board, and a pattern part mounted on a second surface opposite to the first surface of the printed circuit board. The electronic device comprises an integrated circuit chip, and one or more electronic components electrically connected to the integrated circuit chip and at least one of the one or more electronic components is electrically connected to the pattern part.