Protective Coating Structure for Moisture-Resistant Electronic Assemblies
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Solution Overview
Problem
Electronic devices face challenges in effectively blocking moisture and improving reflectivity, particularly due to the limitations of existing protective layers such as solder resist and photoresist, which are prone to pinholes and cracks, leading to corrosion and inadequate light utilization.
Innovation Solution
The electronic device incorporates a thick first protective layer that covers the conductive adhesive and driving elements, enhancing moisture blocking and bonding strength while improving reflectivity by using materials like silicon-based colloids, and optionally a second protective layer for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional protective layers such as solder resist and photoresist are used, then the device structure is simple and easy to manufacture, but they are prone to pinholes and cracks leading to moisture intrusion and corrosion
Solution Approach 1:
The protective layer is divided into multiple segments: a first protective layer covering the conductive adhesive and connection pad, and a second protective layer covering the driving element. This segmentation allows each layer to be optimized for specific protection needs, preventing moisture intrusion through pinholes and cracks while maintaining manufacturing feasibility through standardized layer-by-layer fabrication processes.
Solution Approach 2:
The patent employs composite protective structures combining different material properties. The first protective layer uses materials optimized for moisture barrier performance with high bonding strength to the conductive adhesive, while the second protective layer uses materials optimized for protecting the driving element. This composite approach achieves superior moisture blocking capability without excessive structural complexity.
2Reliability
If a thick protective layer is used to block moisture, then moisture blocking capability is improved, but bonding strength requirements increase
Solution Approach 1:
The first protective layer is specifically designed with local quality optimization at the bonding interface with the conductive adhesive. The material composition and thickness are tailored in this region to achieve both high bonding strength and effective moisture blocking. This localized optimization ensures that the thick protective layer does not compromise bonding while maintaining superior moisture protection.
3Use of energy by moving object
If existing protective layers are used, then manufacturing is simple, but reflectivity is insufficient leading to inadequate light utilization
Solution Approach 1:
The protective layers are designed with specific optical properties including enhanced reflectivity. By controlling the material composition, thickness, and optical characteristics of the protective layers, the structure achieves improved light utilization efficiency. The first protective layer's reflectivity is optimized to redirect light effectively, reducing energy loss while maintaining a relatively simple manufacturing process through conventional coating techniques.
Data Source
AI summary
Disclosed are an electronic device and another electronic device. The electronic device includes a circuit substrate, a conductive adhesive, a driving element and a first protective layer. The circuit substrate includes a connection pad. The conductive adhesive covers the connection pad. The driving element is arranged on the connection pad, and is electrically connected to the circuit substrate through the conductive adhesive. Another electronic device includes a circuit substrate, a first electronic unit, a second electronic unit, and a first protective layer. The first electronic unit is arranged on the circuit substrate and has two side walls. The second electronic unit is arranged on the circuit substrate and has two side walls. The first protective layer at least surrounds a part of both side walls of the first electronic unit and a part of both side walls of the second electronic unit.