Protective Coating for Semiconductor Wafer Lamination Residue
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Solution Overview
Problem
The existing semiconductor manufacturing processes leave behind residue from lamination tape on the topside of semiconductor wafers, which reduces wafer quality and increases defects during inspection.
Innovation Solution
A protective coating material is deposited over the insulating layer and saw street of the semiconductor wafer, followed by the application of lamination tape and subsequent removal, which leaves the coating material intact to prevent residue formation and facilitate clean dicing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If lamination tape is applied over the semiconductor wafer to provide structural support, then the wafer can be handled and processed, but tape residue is left behind on the wafer surface reducing quality
Solution Approach 1:
A release layer is deposited between the lamination tape and the semiconductor wafer surface. This intermediary layer prevents direct adhesion between the tape and wafer, allowing the tape to be removed cleanly without leaving residue. The release layer acts as a mediator that enables the tape to provide structural support during handling while ensuring clean removal afterward.
2Ease of manufacture
If lamination tape is applied directly to the wafer surface, then the application process is simple, but tape residue contaminates the wafer and increases defects
Solution Approach 1:
The release layer is deposited on the wafer surface before applying the lamination tape. This preliminary action prepares the surface to prevent residue formation in advance. By pre-coating the wafer with the release layer, the subsequent tape application and removal processes can proceed without leaving harmful residue, maintaining both ease of manufacture and wafer quality.
3Productivity
If the wafer surface is left unprotected during dicing, then the process is straightforward, but contaminants and debris are generated reducing device quality
Solution Approach 1:
The release layer serves as a protective intermediary during the dicing process. It prevents direct contact between the dicing blade and the sensitive wafer surface, reducing generation of contaminants and debris. This allows the dicing process to proceed efficiently while protecting the wafer quality, as the release layer can be removed afterward without affecting the underlying structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective coating material effectively reduces or eliminates tape residue, enhances the integrity of the insulating layer and build-up interconnect structure, and minimizes contaminants and debris during the dicing process, leading to improved semiconductor device quality and reduced defects.
Implementation Method 1
depositing a protective coating material over the first insulating layer and saw street
Data Source
AI summary
A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the interconnect structure. Bumps are formed over the interconnect structure. A protective coating material is deposited over the insulating layer and saw street. A lamination tape is applied over the coating material. A portion of a back surface of the semiconductor wafer is removed. A mounting tape is applied over the back surface. The lamination tape is removed while leaving the coating material over the insulating layer and saw street. A first channel is formed through the saw street extending partially through the semiconductor wafer. The coating material is removed after forming the first channel. A second channel is formed through the saw street and the mounting tape is removed to singulate the semiconductor wafer.