Protective Film Composition for Semiconductor Heat Dissipation
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Solution Overview
Problem
The existing protective film formation materials face challenges with attachability by tape mounters, leading to fractures and reduced reliability, especially when used in high-performance semiconductor devices where heat dissipation and visibility are critical.
Innovation Solution
A composition for protective film formation is developed, comprising a polymer component, a curable component, and a heat conductive filler with specific particle size and content ratios, optimizing the liquid component content between 20 to 70 parts by mass and the filler content between 40 to 65 volume percent, ensuring excellent attachability, visibility, and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat conductive filler is added to improve heat dissipation properties, then thermal conductivity is improved, but the material becomes brittle and causes fractures during tape mounting
Solution Approach 1:
The patent changes the particle size parameter of the heat conductive filler to a specific range (0.1 μm to 10 μm) and adjusts the liquid component content (20-70 parts by mass per 100 parts resin component). This parameter optimization resolves the contradiction by finding a balance point where sufficient heat dissipation is achieved while maintaining enough flexibility for tape mounting without fractures.
Solution Approach 2:
The patent creates a composite material system combining resin component, heat conductive filler, and liquid component in specific proportions. This composite approach allows the material to simultaneously achieve heat dissipation functionality while maintaining mechanical flexibility for attachment, resolving the contradiction between thermal performance and attachability.
2Ease of operation
If liquid component content is increased to improve attachability, then ease of operation is improved, but the film strength decreases causing fractures
Solution Approach 1:
The patent optimizes the liquid component content to a specific range (20-70 parts by mass per 100 parts resin component). This parameter control ensures sufficient liquidity for easy attachment while preventing excessive softness that would cause fractures, thereby resolving the contradiction between ease of operation and film strength.
3Temperature
If heat conductive filler with small particle size is used to improve heat dissipation, then thermal conductivity is improved, but the material becomes too soft and causes lifting-off and peeling
Solution Approach 1:
The patent specifies the particle size of heat conductive filler within the range of 0.1 μm to 10 μm. This controlled particle size ensures adequate heat dissipation while preventing the material from becoming too soft, thereby maintaining joint stability and preventing lifting-off and peeling issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved attachability, high visibility at laser-printed portions, and enhanced heat dissipation properties, resulting in a protective film-equipped chip with increased reliability and efficient heat management.
Implementation Method 1
a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm... excellent in heat dissipation properties
Implementation Method 2
a curable component (B)... a protective film formed by curing the protective film formation layer
Data Source
AI summary
A composition for protective film formation capable of forming a protective film excellent in attachability by a tape mounter or the like, with good visibility at a laser-printed portion and heat dissipation properties, allowing a protective film-equipped chip having high reliability to be manufactured, and a sheet for protective film formation and a protective film-equipped chip are provided. The composition for protective film formation contains a polymer component (A), a curable component (B), and a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm. The content of components that are liquid at 25° C. contained in the composition for protective film formation is 20 to 70 parts by mass relative to 100 parts by mass of the total of the (A) component and the (B) component.