Protective Film Formation on Electronic Modules via Oscillating Decompression
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Solution Overview
Problem
Conventional methods for forming protective films on electronic modules often result in residual air bubbles between the protective glue and the module, leading to reduced reliability and lifespan due to water vapor infiltration.
Innovation Solution
A method involving a chamber process where the protective material is softened and subjected to alternating pressure cycles, including initial pressure boosting, oscillating decompression, and subsequent pressure boosting, to effectively remove and burst air bubbles, followed by curing to form a bubble-free protective film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective glue is applied mechanically or manually to protect the motherboard, then the protective coverage is achieved, but residual air bubbles remain between the protective glue and the motherboard or electronic elements
Solution Approach 1:
The patent replaces manual/mechanical application methods with a vacuum-based system. The chamber creates negative pressure to automatically draw the protective material against the motherboard and electronic elements, eliminating the need for manual pressing and ensuring complete contact without air bubbles.
Solution Approach 2:
The patent uses a vacuum environment (inert atmosphere of reduced pressure) within the chamber to remove air during the bonding process. This vacuum environment prevents air bubbles from forming between the protective material and the motherboard, ensuring complete adhesion.
2Reliability
If protective glue is applied to cover electronic elements of different sizes, then comprehensive protection is achieved, but air bubbles are difficult to eliminate completely
Solution Approach 1:
The patent replaces complex manual application techniques with a simple vacuum-based system. The uniform negative pressure automatically adapts to electronic elements of different sizes and shapes, making the process easier to manufacture while ensuring complete protection without air bubbles.
Solution Approach 2:
The vacuum chamber system serves multiple functions: it removes air bubbles, applies uniform pressure, and ensures complete coverage simultaneously. This universal approach works for electronic elements of any size or shape, simplifying the manufacturing process while maintaining protection completeness.
3Ease of manufacture
If conventional mechanical application is used, then the process is simple, but water vapor infiltration occurs due to residual air bubbles
Solution Approach 1:
The patent uses a vacuum environment to remove air and prevent water vapor infiltration. The inert atmosphere of reduced pressure eliminates the medium through which water vapor could penetrate, protecting the electronic elements while maintaining process simplicity.
Solution Approach 2:
The patent replaces complex multi-step manual application with a single vacuum-based process that simultaneously achieves complete coverage and eliminates air bubbles. This substitution maintains ease of manufacture while preventing water vapor infiltration through superior adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the occurrence of air bubbles, ensuring a reliable and long-lasting protective film that conforms to the electronic module's surface, enhancing the module's operational lifespan.
Implementation Method 1
a first heating procedure is performed on the protective material in the chamber to soften the protective material placed on the electronic module
Implementation Method 2
a first pressure boosting procedure is performed on the chamber. A pressure in the first pressure boosting procedure is greater than 1 atmosphere
Implementation Method 3
an oscillating decompression procedure is performed on the chamber. The oscillating decompression procedure includes alternately changing pressures in the chamber between multiple low pressures less than 1 atmosphere
Implementation Method 4
a second heating procedure is performed on the protective material in the chamber to cure the protective material covering the electronic module to form the protective film
Data Source
AI summary
A method for forming a protective film on an electronic module includes: placing the electronic module and a protective material placed on the electronic module in a chamber; performing a first heating procedure on the protective material in the chamber, and performing a first pressure boosting procedure, wherein a pressure in the first pressure boosting procedure is greater than 1 atmosphere; after softening the protective material, maintaining the first heating procedure, and performing an oscillating decompression procedure on the chamber, wherein the oscillating decompression procedure includes alternately changing pressures in the chamber between multiple low pressures less than 1 atmosphere; maintaining the first heating procedure, and performing a second pressure boosting procedure on the chamber, wherein a pressure in the second boosting procedure is less than that of the first boosting procedure and greater than 1 atmosphere; and performing a second heating procedure on the protective material in the chamber to form the protective film covering the electronic module.