Electronic Component Module Protective Film for Shielding and Image Recognition
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Solution Overview
Problem
Existing electronic component modules face challenges in achieving high adhesion and low light reflectance for electromagnetic wave shielding, as direct metal film formation increases light reflectance, affecting image recognition accuracy and potentially causing the shield to peel off.
Innovation Solution
An electronic component module with a conductive film covered by a protective film, where the protective film is divided into a low reflective section and a conductive section, ensuring the low reflective section does not contact the conductive film, enhancing adhesion and reducing light reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film is directly formed on the surface of the sealing resin to achieve electromagnetic wave shielding, then the shielding performance is improved, but the light reflectance increases which deteriorates image recognition accuracy
Solution Approach 1:
The protective film is divided into two distinct sections: a low reflective section and a conductive section. This segmentation allows each section to perform its specific function independently - the low reflective section reduces light reflectance for accurate image recognition, while the conductive section provides electromagnetic wave shielding.
Solution Approach 2:
Different regions of the protective film are assigned different optical and electrical properties. The low reflective section has specific reflectance characteristics for image recognition, while the conductive section has high electrical conductivity for shielding. This local differentiation resolves the contradiction by allowing each property to be optimized in its appropriate region.
2Measurement precision
If roughening treatment is applied to the metal film to reduce light reflectance, then image recognition accuracy is improved, but the metal film is etched from the side surface causing the shield to peel off
Solution Approach 1:
The protective film is segmented into a low reflective section and a conductive section. The low reflective section undergoes roughening treatment to reduce light reflectance without affecting the conductive film's adhesion, since the treatments are applied to separate regions.
Solution Approach 2:
The protective film acts as an intermediary layer between the sealing resin and the external environment. It provides both optical properties (through the low reflective section) and electrical properties (through the conductive section) without requiring the metal film itself to have both characteristics, thus avoiding the need to compromise metal film integrity.
3Reliability
If the entire electronic component is surrounded by a metal plate to achieve electromagnetic wave shielding, then shielding performance is improved, but the size of the electronic component module increases
Solution Approach 1:
Instead of using a complete surrounding metal plate, the shielding function is segmented and integrated only where necessary. The conductive film is formed selectively on specific regions of the sealing resin, providing localized electromagnetic wave shielding that maintains effectiveness while reducing overall material usage and module size.
Solution Approach 2:
The protective film combines multiple functions into a single integrated structure. It merges the shielding function (conductive section) with the protective and optical function (low reflective section), eliminating the need for separate metal plate components and reducing the overall module size.
Data Source
AI summary
Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.