Protective Film for Substrate Edge Polishing
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Solution Overview
Problem
Corrosion and uneven film adhesion in the outer peripheral parts of substrates during semiconductor manufacturing lead to scratches and retainer ring abrasion, complicating the polishing process and reducing yield.
Innovation Solution
A method involving the application and curing of a protective film on the substrate's outer peripheral parts before polishing, using a material softer than the substrate to prevent chipping and abrasion, and peeling it off post-processing to avoid subsequent manufacturing issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical polishing is used to remove corrosion and uneven film, then the outer peripheral part can be cleaned, but the shape and outer diameter of the substrate continuously change causing transfer errors
Solution Approach 1:
A protective film is introduced as an intermediary layer between the substrate outer peripheral part and the retainer ring. This film absorbs the mechanical stress and friction during polishing, preventing direct contact between the retainer ring and the substrate edge, thereby avoiding chipping and shape changes while still allowing the polishing process to proceed.
Solution Approach 2:
The protective film is applied beforehand to the outer peripheral part of the substrate to cushion against the potential damage during polishing. This pre-protection prevents the retainer ring from causing chipping or deformation to the substrate edge, maintaining the substrate's original shape and outer diameter throughout the polishing process.
2Ease of operation
If retainer ring is used to hold substrate during polishing, then substrate can be secured, but retainer ring abrasion causes scratches on substrate surface
Solution Approach 1:
The protective film serves as a mediator between the retainer ring and the substrate surface. It allows the retainer ring to maintain its holding function while preventing direct contact with the substrate, thus avoiding the generation of scratches on the substrate surface during polishing operations.
Solution Approach 2:
By applying the protective film beforehand to the outer peripheral part, the system cushions against the abrasive action of the retainer ring. This pre-protection ensures that even though the retainer ring contacts the substrate area, no scratches are generated on the actual substrate surface.
3Reliability
If multiple chemical solutions are used to remove different film types, then complete film removal is achieved, but the process becomes complicated and protective film shape is varied
Solution Approach 1:
The protective film is designed to be selectively removable from the outer peripheral part after serving its protective function during polishing. This extraction allows the film to be applied and removed in a controlled manner, providing protection when needed while avoiding the complexity of multiple chemical solutions by using a single removable film material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective film acts as a shock-absorber, reducing substrate chipping and retainer ring abrasion, enhancing the polishing process while preventing post-processing contamination.
Implementation Method 1
The protective film acts as a shock-absorber, reducing substrate chipping and retainer ring abrasion
Implementation Method 2
the process of forming the protective film includes applying a protective film material in a liquid form onto the outer peripheral part of the substrate and curing the applied protective film material
Data Source
AI summary
One object is to suppress the surface of a substrate from being scratched in the course of a polishing process. There is provided a method of processing a substrate, comprising: a process of forming a protective film on an outer peripheral part of the substrate including a bevel portion, prior to a process of polishing the substrate, wherein the process of forming the protective film includes applying a protective film material in a liquid form onto the outer peripheral part of the substrate and curing the applied protective film material; and the process of polishing the substrate with the protective film formed on the outer peripheral part thereof.