Protective Film Temperature Sensing for Server Motherboard Power Control

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Solution Overview

Problem

Server motherboards can experience abnormal situations like short circuits, leading to high currents and heat generation, which can cause the substrate to burn at elevated temperatures, posing a risk of failure and damage to modules.

Innovation Solution

A protective film is applied to the substrate, with an equivalent electrical parameter that changes as the film's shape alters with temperature, allowing a power supply circuit to detect these changes and stop power output when the temperature exceeds a predetermined level, preventing further heat accumulation and potential burns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective film is applied to the substrate to detect temperature changes, then the reliability of the server motherboard is improved, but the device complexity increases

Engineering Contradiction:
Improveprotection against substrate burningVSAvoidstructure with protective film and power supply circuit
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protective film integrates multiple functions: it serves as both a protective covering and a temperature-sensitive detection element. The film's electrical parameters change with temperature, allowing it to function as both a physical protector and a sensing mechanism, thereby improving reliability without proportionally increasing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The protective film is designed to perform multiple roles simultaneously: mechanical protection of the substrate, temperature sensing through electrical parameter changes, and triggering the power supply circuit to disconnect when overheating is detected. This multi-functionality resolves the contradiction by achieving enhanced reliability through a single integrated component rather than multiple separate systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If fuses are installed at each PCB position to prevent burning, then the reliability is improved, but the device complexity and cost increase

Engineering Contradiction:
Improveprotection against substrate burningVSAvoidmultiple fuses at different positions
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts the protection function from multiple distributed fuses and consolidates it into a single power supply circuit controlled by the protective film's temperature-sensitive electrical parameters. This removes the need for multiple fuses at different PCB positions, reducing device complexity while maintaining reliability through centralized thermal monitoring and power control.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If the power supply circuit continuously monitors the protective film's electrical parameters, then the reliability is improved, but the energy consumption increases

Engineering Contradiction:
Improvecontinuous temperature monitoringVSAvoidenergy consumption of power supply circuit
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The power supply circuit employs periodic or event-driven monitoring of the protective film's electrical parameters rather than continuous monitoring. The circuit checks the electrical parameters at intervals or triggers monitoring when specific conditions are detected, allowing reliable temperature monitoring while reducing energy consumption compared to constant real-time monitoring.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively protects the PCB and modules by preventing power supply voltage output when excessive heat is detected, reducing the risk of substrate burning and module damage, while avoiding the need for fuses at each PCB position, thus lowering costs and simplifying protection measures.

Implementation Method 1

The equivalent electrical parameter of the protective film changes as a shape of the protective film changes. The shape changes when a temperature of the server mother board is greater than a predetermined temperature.

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12101885B2Server motherboard, server, and power supply control method
Publication Date: 2024.09.24 LENOVO (BEIJING) LTD
  • US12101885B2 patent drawing
  • US12101885B2 patent drawing
  • US12101885B2 patent drawing

AI summary

A server motherboard includes a protective film, a substrate, and a power supply circuit. An equivalent electrical parameter of the protective film changes as a shape of the protective film changes. The shape changes when a temperature of the server mother board is greater than a predetermined temperature. A portion of at least one side surface of the substrate is covered by the protective film. The power supply circuit is electrically connected to the protective film and configured to detect the equivalent electrical parameter of the protective film. The power supply circuit stops outputting a power supply voltage to the substrate when a change of the equivalent electrical parameter is detected.