Protective Film Adhesion Using Thiol Coupling Agents
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Solution Overview
Problem
Existing protective film-forming films for semiconductor chips, particularly those with metal films on the back surface, face issues with adhesive force, especially under high-temperature conditions, leading to peeling off from the metal film.
Innovation Solution
A protective film-forming film is developed using a composition that includes a coupling agent with a thiol group or a protected thiol group, an acrylic resin with a glass transition temperature of −3° C. or higher, and an inorganic filler ratio of 55 mass % to 75 mass %, which enhances the adhesive force and reliability of the protective film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional protective film-forming film is bonded to a metal film on a semiconductor chip back surface, then the metal film is protected, but the adhesive force is insufficient and the protective film peels off under high-temperature conditions
Solution Approach 1:
A coupling agent with thiol group or protected thiol group is introduced as an intermediary substance between the protective film-forming film and the metal film. The coupling agent forms strong chemical bonds with both the metal substrate and the film components, acting as a molecular bridge that significantly enhances adhesion and prevents peeling under thermal stress
Solution Approach 2:
The chemical composition parameters of the protective film-forming film are modified by incorporating specific coupling agents with thiol groups. This changes the chemical reactivity and bonding characteristics of the film, enabling it to form strong bonds with metal surfaces while maintaining stability under high-temperature conditions
2Volume of moving object
If the thickness of the semiconductor device is reduced to include metal film on back surface, then device miniaturization is achieved, but the metal film requires protective coating which conventional films cannot adhere to properly
Solution Approach 1:
The coupling agent serves as an intermediary layer that enables reliable bonding between the thin-structured metal film and the protective film-forming film. This mediator overcomes the adhesion problem inherent in bonding directly to metal surfaces, allowing effective protection of miniaturized devices with thin metal back surfaces
Solution Approach 2:
The protective film-forming film is formulated as a composite material system containing multiple components including coupling agents, resins, and other functional materials. This composite structure provides both strong adhesion to the thin metal film and adequate protective properties, solving the dual requirement of miniaturization and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective film-forming film effectively prevents peeling off from the metal film even after temperature changes, ensuring high reliability and durability.
Implementation Method 1
a protective film-forming film for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. The protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.
Data Source
AI summary
A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.