Protective Insulating Layer for Output Wiring in Display Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing touch panel technologies face issues with thickness, weight, and reliability due to the integration of touch sensors with display panels, including flaws and corrosion in output wiring, and inefficient processing methods that affect electrical connections.
Innovation Solution
A display device design featuring a translucent opposite substrate with a sensing unit and an element substrate, where the output wiring is buried under a protective insulating layer and a peripheral member, with a sealing member to ensure uniform contact and protection, and flexible printed circuits are used to connect the electrodes, reducing the need for direct contact and enhancing durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a touch sensor panel is integrated with a display panel, then the touch panel becomes thinner, but the output wiring is exposed and susceptible to breaking and corrosion
Solution Approach 1:
The patent introduces a protective insulating layer as an intermediary substance between the output wiring and the external environment. This layer acts as a barrier that prevents moisture and contaminants from contacting the metal wiring, thereby preventing corrosion and breaking while maintaining the thin panel structure. The protective insulating layer is specifically designed to cover the output wiring without significantly increasing panel thickness.
2Ease of manufacture
If output wiring is processed by dry etching after transparent conductive film formation, then wiring can be formed, but the transparent conductive film electrode pattern is etched
Solution Approach 1:
The patent applies a protective insulating layer to the output wiring before performing the dry etching process. This preliminary protective action prevents the etching plasma from damaging the transparent conductive film electrode pattern during wiring formation. The protective layer is selectively removed or designed to allow etching of the wiring while protecting the electrode pattern, thereby enabling wiring formation without compromising electrode integrity.
3Ease of manufacture
If output wiring is processed by wet etching, then wiring can be formed, but electrolytic corrosion occurs preventing electrical contact
Solution Approach 1:
The patent introduces a protective insulating layer as a barrier between the metal output wiring and the wet etching solution. This intermediary layer prevents direct contact between the metal and the chemical solution, thereby preventing electrolytic corrosion that would otherwise occur during wet etching. The protective layer allows the wet etching process to proceed for wiring formation while maintaining the integrity and electrical conductivity of the output wiring.
4Reliability
If flexible printed circuits are attached to both element substrate and opposite substrate, then electrical connections are established, but the two substrates must be kept thin requiring precise fixing
Solution Approach 1:
The patent merges the output wiring formation process with the transparent conductive film formation process by using the same patterning and deposition steps. This integration reduces the number of separate processes and substrates needed, thereby simplifying the overall assembly complexity while maintaining reliable electrical connections through the combined electrode-wiring structure.
Data Source
AI summary
In a seal part where a translucent opposite substrate and an element substrate are bonded together, a peripheral member is provided in such a manner as to be buried in a sealing member. This prevents the sealing member from breaking, thus making it possible to make the seal part durable to improve the strength of the panel. Further, an output wiring connected to an electrode pattern of a sensing unit can be protected by being covered with a protective insulating layer. The peripheral member and the protective insulating layer can be formed by the same insulating material. This makes it possible to simplify the process to reduce production costs.