Protective Layer Structure for Hollow Electronic Component Sealing
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Solution Overview
Problem
The existing connection methods for electronic components with hollow spaces, such as surface acoustic wave devices, often result in decreased close contact performance between the protective layer and the covering portion, leading to compromised protection characteristics due to peeling-off issues, which can allow moisture ingress and affect electrical properties.
Innovation Solution
The protective layer is directly connected to the support body without the covering portion being interposed, with cutout portions providing increased contact area and symmetry to prevent peeling-off and maintain close contact, thereby enhancing the protection characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the protective layer is connected only to the covering portion, then the structure is simple, but the close contact performance decreases leading to peeling-off
Solution Approach 1:
The connection structure is segmented into two distinct connection paths: one through the covering portion and another directly to the support body. This segmentation allows the protective layer to maintain reliable contact through multiple independent paths, preventing peeling-off while keeping each individual connection path relatively simple.
Solution Approach 2:
The protective layer merges two connection approaches: connection through the covering portion and direct connection to the support body. By combining these connection methods, the system achieves superior close contact performance and peeling resistance compared to using either method alone.
2Reliability
If the protective layer is directly connected to the support body, then peeling-off is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The support body is prepared in advance with a designated contact surface that is ready to receive the protective layer. This preliminary preparation includes forming the first surface with appropriate properties (flatness, cleanliness, adhesion characteristics) before the protective layer is applied, making the subsequent direct connection process more straightforward and reliable.
Solution Approach 2:
The first surface of the support body acts as an intermediary between the protective layer and the internal structures. This intermediate surface provides a stable, controlled interface that facilitates reliable direct connection, simplifying the manufacturing process by creating a dedicated bonding interface.
3Object-affected harmful factors
If the protective layer contacts only the covering portion, then the structure is compact, but moisture ingress occurs due to peeling-off
Solution Approach 1:
The protective barrier is segmented into two separate sealing paths: one through the covering portion and another directly through the support body. This segmentation creates redundant protection zones, so if one path develops peeling or defects, the other path continues to prevent moisture ingress, enhancing overall moisture resistance.
Solution Approach 2:
The direct connection to the support body provides a backup protection path in advance. This redundant connection ensures that even if the covering portion connection deteriorates over time, the protective layer maintains its moisture barrier function through the direct support body connection, cushioning against future failure.
Data Source
AI summary
An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.