Protective Layer for Electronic Device Injection Molding
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Solution Overview
Problem
The challenge in manufacturing thin electronic devices is protecting sensitive components from damage during the injection molding process, which involves high temperatures and forces, while also preventing overheating and maintaining device thickness.
Innovation Solution
An electronic device design featuring an electrically insulating and potentially thermally conductive protective layer overlaying electronic components, combined with injection molded material, and a mechanical substrate for support and heat dissipation, allowing the injection molded material to be in close proximity without damaging the components and maintaining device thinness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If injection molding is used to form covers, then device thickness can be reduced, but electronic components may be damaged by high temperature and injection force
Solution Approach 1:
A protective layer is introduced as an intermediary between the electronic component and the injection molded material. This protective layer withstands the high temperature and injection force of the molding process, preventing damage to the electronic component while allowing the molded material to be in close proximity to the component, thus reducing device thickness.
Solution Approach 2:
The protective layer is applied to the electronic component before the injection molding process. This preliminary protective measure ensures the component is shielded from the harsh molding conditions (high temperature and pressure) before they occur, enabling safe integration of the molded cover at minimal thickness.
2Reliability
If protective layer is added to protect components during injection molding, then component integrity is maintained, but device thickness may increase
Solution Approach 1:
The protective layer is implemented as a thin film or coating that provides sufficient protection during injection molding while minimizing thickness addition. The layer is thin enough to maintain overall device slimness but thick enough to withstand the molding process conditions.
3Length of stationary object
If injection molded material is placed in close proximity to electronic components, then device thickness is reduced, but components may overheat
Solution Approach 1:
The protective layer serves as a thermal intermediary between the electronic component and the injection molded material. It allows the molded material to be positioned close to the component for thinness while managing thermal interaction, preventing direct heat transfer that could cause overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer safeguards electronic components during injection molding, reduces device thickness, and prevents overheating by conducting heat away from sensitive components, ensuring the integrity and performance of thin electronic devices.
Implementation Method 1
The protective layer may also be thermally conductive. This may also provide the further advantage that it prevents the electronic component from over heating in use as it can conduct heat generated away from the electronic component.
Implementation Method 2
the mechanical substrate provides mechanical support and acts as a heat sink to transfer heat away from the electronic component during injection molding
Data Source
AI summary
An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.