Protective Lid Package Structure for EMI Shielding and Crack Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges in achieving high density and functionality while effectively managing electromagnetic interference (EMI) and ensuring package reliability.
Innovation Solution
A package structure is formed with a substrate carrying one or more dies or packages, a protective lid that serves as a warpage-control and heat dissipation element, and hybrid adhesive elements, where one adhesive is electrically conductive to form a ground connection and reduce EMI, and another is non-conductive to prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single adhesive element is used to attach the protective lid to the substrate, then the manufacturing process is simple, but the package structure cannot simultaneously reduce EMI and prevent cracking
Solution Approach 1:
The adhesive element is divided into two distinct segments: a first adhesive element with conductive filler for EMI reduction and a second adhesive element without conductive filler for crack prevention. This segmentation allows each adhesive element to perform its specific function independently, resolving the contradiction between reliability improvement and structural complexity by providing a clear functional division that is straightforward to implement in manufacturing.
Solution Approach 2:
The first adhesive element is formulated as a composite material containing conductive filler particles embedded in the adhesive matrix, while the second adhesive element uses a non-conductive adhesive material. This composite approach enables the package structure to simultaneously achieve EMI shielding and crack prevention functions through material composition rather than complex structural design.
2Object-affected harmful factors
If conductive adhesive is used throughout the package structure, then EMI is reduced, but cracking risk increases due to stress concentration
Solution Approach 1:
The conductive filler is applied locally only in the first adhesive element where EMI reduction is most critical for electrical connection stability, while the second adhesive element maintains non-conductive properties to provide stress distribution and prevent cracking. This local quality differentiation allows the package to achieve EMI protection where needed without compromising overall structural strength.
3Strength
If non-conductive adhesive is used throughout the package structure, then cracking is prevented, but EMI protection is insufficient
Solution Approach 1:
The adhesive system is segmented into two functional zones: the first adhesive element containing conductive filler positioned for EMI reduction and electrical connection, and the second adhesive element without conductive filler positioned for stress distribution and crack prevention. This segmentation resolves the contradiction by assigning different material properties to different spatial locations based on functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the performance and reliability of the package structure by reducing EMI and preventing cracking, enhancing the overall quality and functionality of the semiconductor package.
Implementation Method 1
The first adhesive element is electrically conductive and is capable of forming an electrical connection between the protective lid and a ground structure
Implementation Method 2
a protective lid that serves as a warpage-control and heat dissipation element
Data Source
AI summary
A package structure is provided. The package structure includes a substrate and a ground structure laterally surrounded by the substrate. The package structure also includes a chip-containing structure over the substrate and a protective lid attached to the substrate through a first adhesive element and a second adhesive element. The ground structure is electrically connected to the protective lid through the first adhesive element. The second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.