Protective Member for Coreless Substrate Warping Prevention
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Solution Overview
Problem
Semiconductor packages face issues with warping, damage, and increased manufacturing costs due to the vulnerability of coreless substrates like embedded trace substrates during molding and marking processes, which complicates the process and increases defect rates.
Innovation Solution
A method of manufacturing a semiconductor package that includes attaching a protective member with a heterojunction structure, comprising an adhesive layer and a protective film, to the substrate to prevent warping and damage, and removing it after encapsulation to form solder balls, thereby controlling thermal expansion and contraction to prevent substrate deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a coreless substrate technique (embedded trace substrate) is used to make the printed circuit board thinner, then the thickness is reduced, but the substrate becomes vulnerable to physical and thermal changes, leading to warping and damage during molding and marking processes
Solution Approach 1:
A protective member is attached to the substrate before the molding process to prevent warping and damage. This preliminary protective action addresses the vulnerability of the thin coreless substrate during subsequent manufacturing processes, allowing the substrate to maintain its structural integrity throughout production.
Solution Approach 2:
The protective member acts as an intermediary between the thin substrate and the molding/marking processes. It provides the necessary mechanical support and protection during manufacturing, enabling the use of coreless substrates without compromising reliability.
2Reliability
If the printed circuit board structure is modified or additional processes are added to overcome substrate defects, then substrate reliability is improved, but the thickness of the PCB increases and the process becomes more complex
Solution Approach 1:
The solution separates the protective function from the substrate structure itself by using a distinct protective member. This segmentation allows the thin substrate to maintain its coreless design while the separate protective component provides the necessary support, avoiding the need to complicate the substrate structure.
Solution Approach 2:
The protective member serves as an intermediary solution that addresses substrate vulnerabilities without requiring modifications to the coreless substrate design. This approach maintains process simplicity while improving reliability.
3Reliability
If the printed circuit board structure is modified or additional processes are added to overcome substrate defects, then substrate reliability is improved, but manufacturing costs increase
Solution Approach 1:
The protective member is a temporary, inexpensive component attached during manufacturing and then removed. This disposable protective element provides necessary support during critical processes without adding permanent complexity or cost to the final product.
Solution Approach 2:
The protective member provides a cost-effective intermediary solution that prevents substrate defects during manufacturing without requiring expensive modifications to the coreless substrate design or additional permanent process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces defect rates, increases productivity, and prevents substrate damage during the semiconductor package process, while maintaining the thinness of the printed circuit board, thus addressing the challenges of warping and cost complexity.
Implementation Method 1
controlling thermal expansion and contraction to prevent substrate deformation
Implementation Method 2
controlling thermal expansion and contraction to prevent substrate deformation
Implementation Method 3
a protective member with a heterojunction structure, comprising an adhesive layer and a protective film
Data Source
AI summary
A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.