Protective Ring Shields Bond Layer in Plasma Substrate Support
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Solution Overview
Problem
The bond layer in substrate supports used in plasma processing systems is prone to erosion during semiconductor etching processes, leading to reduced operational lifetime and performance degradation.
Innovation Solution
A method involving the attachment of a protective ring, typically made of fluorocarbon polymer material, is applied around the bond line between the upper and lower members of the substrate support, using an adhesive and machining to secure it in place, which expands to fit snugly around the bond line, providing protection against plasma-induced erosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bond layer is used to attach substrate support members, then mechanical compliance and thermal conduction are improved, but the bond layer is eroded by plasma causing reduced operational lifetime
Solution Approach 1:
A protective ring made of erosion-resistant material (such as tungsten, molybdenum, or other plasma-resistant materials) is introduced as an intermediary component between the bond layer and the plasma environment. The protective ring is positioned around the outer periphery of the upper member and upper periphery of the lower member, shielding the bond layer from direct plasma exposure while maintaining the mechanical and thermal functions of the bond layer.
Solution Approach 2:
The protective ring is installed on the bond layer before the substrate support is subjected to plasma processing. This preliminary protective measure prevents plasma-induced erosion of the bond layer, allowing the bond layer to maintain its integrity and functional performance throughout the operational lifetime of the substrate support.
2Reliability
If the protective ring is positioned around the bond line, then erosion protection is improved, but device complexity increases
Solution Approach 1:
The protective ring is designed as a thin-walled cylindrical structure that can be easily fitted around the bond line. This thin-film approach provides effective plasma erosion protection while minimizing the additional material volume and structural complexity introduced to the substrate support assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective ring effectively slows down the erosion of the bond layer, extending the operational lifetime of the electrode assembly and maintaining system performance by preventing noticeable degradation.
Implementation Method 1
A method involving the attachment of a protective ring, typically made of fluorocarbon polymer material, is applied around the bond line between the upper and lower members of the substrate support, using an adhesive and machining to secure it in place, which expands to fit snugly around the bond line, providing protection against plasma-induced erosion
Data Source
AI summary
A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.